28 July 2004Manufacturing / Production Technology, Hardware & Services
The time for lead-free SMT assembly is rapidly approaching. Assembly with lead-free solders is going to demand higher print quality to achieve a good solder joint. Tin-silver melts at a higher temperature and does not have the wetting characteristic that a tin-lead eutectic has. This means, whereas some error in the printing process may be corrected by the strong wetting and cohesion forces of tin-lead, these same errors will not be adjusted with tin-silver during reflow. Transition Automation thus developed a special high quality Permalex coated squeegee that can offer improved printing.
Lead is a lubricating element; and silver and tin are both harder, and less likely to reduce friction than tin-lead. Lead stretches, shears, fills, and otherwise smoothes out any process of sliding between two elements. The Permalex metal squeegee infused with a polymer lubricant helps eliminate the sticking of solder paste which typically is seen on regular metal squeegees. The switch to lead-free solder pastes and a lead-free process will likely push all equipment and materials into a higher level. It is also likely that lower quality squeegees will not work well with the new lead-free solder process.
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