Erni's new connectors for board-to-board connections in modern telecom and datacom applications, called Microspeed, have 100 Ω differential impedance or 50 Ω single-ended. While 'micro' refers to the small size of the connectors, having a horizontal pin spacing of only 1,0 mm, the company claims their performance is 'macro'.
With an optimum pin configuration and a pitch of 1,0 mm (horizontal) and 1,5 mm (vertical), they ensure effective routing and superior signal integrity. The differential ports can be arranged both in parallel (in a row) and vertically. Microspeed connectors handle transmission rates of up to 10 Gbps with minimal crosstalk. Their reliability and integrity is ensured by effective shielding using ground contacts as well as an HF-optimised female contact design.
They are suited to applications requiring fast, space-saving board-to-board connections. This means that board/board spacing can be reduced to only 5 mm. The SMT design ensures fully automated SMT assembly and reflow soldering processes Microspeed systems provide flexible and reliable solutions for highly integrated applications, such as computer boards arranged in sandwich configurations or for compact end-devices used in offices and telecommunications.
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