AI & ML

• Development kit for AI and edge applications

• From the editor's desk: Groq – the future of AI processing?

Analogue, Mixed Signal, LSI

• High voltage instrument op-amp

Circuit & System Protection

• Clearing the Static: Conductive foot, heel and shoe grounders

Design Automation

• MPLAB PICkit Basic

DSP, Micros & Memory

• Chipset enables ultra-wide signal capture
• Evaluation kit for ML applications

• Microprocessors with advanced graphics and connectivity
• SoC for real-time AI at the edge

Enclosures, Racks, Cabinets & Panel Products

• Building the control panels of the future

• High visibility 4-digit panel ammeters
• Multi-channel SMPS cable assemblies

Interconnection

• mBend cable assemblies

Manufacturing / Production Technology, Hardware & Services

• G-Tera high-speed SMT printer
• Microtronix produces smart meters for Eskom
• Next-generation SPI and AOI series
• Reliable X-ray inspection system

• The factory beat
• The ultimate range for design and repair
• Yamaha’s Advanced Safety Package eases factory-safety
• Design & Repair range from RS Pro
• Extending AI assistance in AOI

Opto-Electronics

• Easy Nixie tube display

Passive Components

• HiRel components from Kyocera AVX

Power Electronics / Power Management

• Full telemetry in tiny DC-DC converters
• Power IC supplies 1650 W

• Chokes rated at 36 A
• High-voltage contactors
• High-voltage step-down DC-DC converter

Telecoms, Datacoms, Wireless, IoT

• GNSS antenna redefining what’s possible
• Innovative satellite navigation receiver
• Remote provisioning firmware added to SIMCom modules

• Smart module for multi-media devices
• u-blox expands NORA-B2 BLE modules
• 1 Mbit EEPROM with fast read/write capabilities
• Danfoss radiator valve modification project demonstrates effectiveness of NeoMesh wireless mesh networking technology in smart buildings

Test & Measurement

• Handheld RTSA up to 9,5 GHz