DSP, Micros & Memory


Latest Articles

TDK introduces a high-speed TMR front-end IC
23 November 2022, Avnet Abacus
TDK Corporation has complemented its existing TMR sensor portfolio with the new Micronas signal-conditioning IC, ASA 2310, for high-speed automotive and industrial electric motor applications.

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Industrial Gigabit Ethernet transceivers offer PTP
23 November 2022, Avnet Silica
Microchip has announced the LAN8840 and LAN8841 Gigabit Ethernet transceiver devices, that meet IEEE 1588v2 standards for Precision Timing Protocol (PTP).

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Silicon Labs’ BG24 and MG24 win gold
23 November 2022, Altron Arrow
In the category of connectivity at the recent 2022 LEAP Awards, the Gold was awarded to Silicon Labs’ BG24 and MG24 families of 2,4 GHz wireless SoCs.

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The significance of the Matter standard
23 November 2022, Altron Arrow, Editor's Choice
Matter is an automation connectivity standard that has been designed with the main purpose of reducing fragmentation across IoT products from different vendors, and this will transform the automation landscape by achieving interoperability among smart home platforms.

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A new standard for entry-level edge AI
23 November 2022, Altron Arrow
Nvidia has announced the Jetson Orin module with Ampere Architecture GPU, fast memory bandwidth and high-speed IO, the perfect solution for next generation AI and robotics applications.

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Machine Learning with Microchip Technology
23 November 2022, TRX Electronics, Editor's Choice
Microchip Technology machine learning involves selecting the software and hardware kits, reference designs, and silicon platforms that are required to build a machine-learning model.

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Scaling ML processing with external AI accelerators
23 November 2022, Altron Arrow, AI & ML
Combining the native ML processing capabilities of NXP’s i.MX applications processors with dedicated ML accelerators from NXP ecosystem partners such as Kinara, creates an even larger scalability range than that offered by NXP alone, while still maintaining software reuse.

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New Arm-based PIC microcontrollers with Bluetooth LE
23 November 2022, Future Electronics
Microchip’s PIC32CX-BZ2 family includes system-on-chip devices and, in addition to Bluetooth Low Energy functionality, includes Zigbee stacks and Over the Air (OTA) update capabilities.

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Smart metering platform available on a 32-bit MCU
23 November 2022, Altron Arrow
Microchip has announced the PIC32CXMT family of 32-bit microprocessors with a new MPL460 power line communication (PLC) modem integrated into the SoC.

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MCX N series microcontrollers
23 November 2022, Future Electronics, AI & ML
The MCX N series from NXP features high-performance, low-power microcontrollers with smart peripherals and accelerators to provide the ultimate balance between performance and power consumption.

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High-precision, linear 3D Hall-effect sensor
23 November 2022, Altron Arrow
The TMAG5173-Q1 from Texas Instruments is a low-power linear 3D Hall-effect sensor which integrates three independent sensors in the X, Y, and Z axes.

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Ultra-low power 32 Mbit serial page EEPROM
23 November 2022, Altron Arrow
The M95P32-I and M95P32-E are manufactured with ST’s advanced proprietary NVM technology and offer byte flexibility, high page-cycling performance, and ultra-low power consumption.

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ModusToolbox 3.0
23 November 2022, Altron Arrow
This new release includes several new features targeted at multi-core development, and user-defined BSP management.

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Infineon expands PSoC product family
26 October 2022, Altron Arrow
Infineon has announced the release of the PSoC 4100S Max, a highly integrated, low-cost solution with next-gen CAPSENSE technology that allows engineers to easily design and rapidly bring to market a low-cost HMI system.

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‘Works With’ free technical training
26 October 2022
In this training learn how to accelerate development across protocols, and how to connect to ecosystems like Google, Amazon, and Samsung SmartThings.

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ST’s new Stellar P automotive MCU
26 October 2022, Altron Arrow
These automotive MCUs are the industry’s first qualifiable devices for vehicles to integrate the new CAN-XL in-car communication standard.

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New LTE smart module for machine vision AI applications
26 October 2022, iCorp Technologies
Quectel Wireless Solutions has announced its new SC680A smart module which features broad connectivity options including LTE Cat 6, Wi-Fi 802.11ac and Bluetooth 5.0, with powerful system performance and rich multimedia functions.

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New hybrid sensor for in-car safety and comfort monitoring
26 October 2022, Avnet Silica
New applications enabled by ST’s new image sensor include passenger safety-belt checks, vital-sign monitoring, child-left detection, gesture recognition, and high-quality video/picture recording.

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Securing the industrial IoT: trusted solutions for embedded platforms
26 October 2022, Altron Arrow
Industrial IoT (IIoT) is transforming the way industries operate. At its core, data is acquired, analysed and turned into actionable insights to solve problems for faster decision-making. But IIoT devices and infrastructure are becoming high-value cyber targets.

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New ARINC 429 receiver
26 October 2022, ASIC Design Services
Holt Integrated Circuits has announced the release of a new eight-channel ARINC 429 line receiver which can interface up to eight ARINC 429 receive buses to a high-speed serial peripheral interface-enabled microcontroller.

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