DSP, Micros & Memory


New hybrid sensor for in-car safety and comfort monitoring

26 October 2022 DSP, Micros & Memory

As leading automotive markets start to mandate driver-monitoring systems (DMS), STMicroelectronics is already equipping carmakers with the required technologies. While DMS promises greater road safety by assessing driver alertness, the next-generation dual image sensor from ST monitors the full vehicle interior, covering both the driver and all passengers. New applications enabled by ST’s new image sensor include passenger safety-belt checks, vital-sign monitoring, child-left detection, gesture recognition, and high-quality video/picture recording.

“The DMS market is growing at a double-digit pace and ST’s new image sensor is set to push that forward by enabling brands to create new services and deliver even greater value for vehicle users, leveraging complete in-cabin monitoring that covers multiple occupants,” said Eric Aussedat, executive vice president, imaging sub-group general manager, STMicroelectronics. “Our market-leading DMS sensor provided the perfect launchpad to take the technology further and empower new innovations.”

The new sensor, the VD/VB1940, delivers a cost-effective solution that combines the sensitivity and high resolution of infrared sensing with high dynamic range (HDR) colour imaging in a single component. It can capture frames in rolling-shutter or global-shutter modes. With 5,1-megapixels, it captures the high-dynamic-range (HDR) colour images needed for an occupant monitoring system (OMS) in addition to the high-quality near-infrared (NIR) images typically captured by standard DMS sensors. DMS uses NIR imaging to analyse driver head and eye movements in all lighting conditions.

The new automotive image sensor uses ST’s second-generation 3D-stacked back-side illuminated (BSI) wafer technology, which maximises the optical area and on-chip processing in relation to die size. This lets the sensor perform sophisticated algorithms locally for optimal performance in both colour and NIR imaging, saving power and relieving demand for an external co-processor.

Algorithms performed on-chip include Bayer conversion and HDR merging for optimal image-quality and frame rate. On-chip Bayerisation processing enables the user to reshuffle the colour pixels of the RGB NIR 4X4 pattern into the RGGB format compatible with a wide range of SoCs. In addition, local processing also handles independent colour and NIR pixel-exposure optimisation for optimum image quality in both modes, as well as smart upscaling to maximise NIR image resolution by capturing extra NIR information from RGB pixels.

ST has planned to meet demand for 2024 model vehicles that are currently in design.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

KIOXIA pioneer new 3D Flash technology
EBV Electrolink DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.

Read more...
Artificial intelligence meets embedded development
Avnet Silica DSP, Micros & Memory
Microchip Technology is leveraging the power of artificial intelligence (AI) to assist software developers and embedded engineers in writing and debugging code with the launch of its MPLAB AI Coding Assistant.

Read more...
Embedded module for AI vision applications
Rugged Interconnect Technologies DSP, Micros & Memory
The TQMa95xxSA supports AI/ML with vision applications through an integrated NPU and an image processor unit.

Read more...
High-speed Flash for SoC applications
NuVision Electronics DSP, Micros & Memory
GigaDevice has unveiled the GD25NE series of dual-power supply SPI NOR Flash chips, designed specifically for 1,2 V system-on-chip (SoC) applications.

Read more...
Super-fast H.264 encoder FPGA core
EBV Electrolink DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.

Read more...
ST MCUs extend ultra-low power innovation
Altron Arrow DSP, Micros & Memory
STMicroelectronics has introduced new STM32U3 microcontrollers with cutting-edge power-saving innovations that ease deployment of smart connected tech, especially in remote locations.

Read more...
Chipset enables ultra-wide signal capture
RFiber Solutions DSP, Micros & Memory
Jariet Technologies has developed Electra, a chipset that enables ultra-wide, multi-function and multi-band signal capture and generation from a single component.

Read more...
SoC for real-time AI at the edge
Future Electronics DSP, Micros & Memory
Ambiq’s Apollo330 Plus series is purpose-built to enable always-on and real-time AI inferencing on devices.

Read more...
Evaluation kit for ML applications
Future Electronics DSP, Micros & Memory
The hardware kit includes radar, acoustic, pressure and motion sensors and integrates dual Arm Cortex-M4 and Cortex-M0+ CPU cores.

Read more...
Microprocessors with advanced graphics and connectivity
Avnet Silica DSP, Micros & Memory
Microchip’s SAMA7D65 MPU runs a 1 GHz Arm Cortex-A7 core and integrates MIPI DSI, LVDS display interfaces and 2D GPU for HMI applications.

Read more...