Designed with input from the engineering and maker communities, Texas Instruments unveiled the new MSP430 USB LaunchPad Evaluation Kit and supporting ecosystem of software and support for its portfolio of USB microcontrollers.
Together with the added functionality of TI’s new near field communication (NFC) BoosterPack and NFCLink library, the company is providing a starting point for developers to tap into what’s being called the Internet of Things (IoT).
The MSP-EXP430F5529LP LaunchPad, based on the ultra-low-power MSP430F5529 microcontroller (MCU), provides engineers and makers of all experience levels more connectivity, memory and performance options for a variety of low-power consumer, industrial, medical and wireless connectivity applications.
To ease development, TI’s MSP430 USB portfolio includes the comprehensive MSP430 USB Developers Package which contains free and open source USB API stacks, source code, sample applications and a code-gen tool to quickly configure USB applications for all MSP430 USB microcontrollers.
Based on the TRF7970A NFC transceiver, the DLP7970ABP NFC BoosterPack gives developers a quick and easy connection via NFC. TI’s existing Wi-Fi, sub-1 GHz and ZigBee BoosterPacks can also easily plug into the MSP430 USB LaunchPad to enable wireless connectivity to smart home and building, health and fitness, and portable consumer applications.
The new MSP-EXP430F5529LP LaunchPad includes support for Energia. This community-developed, open source integrated development environment (IDE) based on the Wiring framework enables code compatibility across TI’s Energia-supported MCU LaunchPads and BoosterPacks including the new NFC BoosterPack and recently announced SimpleLink Wi-Fi CC3000 BoosterPack.
KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Super-fast H.264 encoder FPGA core EBV Electrolink
DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.
Read more...Power IC supplies 1650 W EBV Electrolink
Power Electronics / Power Management
Power Integrations has announced a two-fold increase in power output from the HiperLCS-2 chipset with the new device now being able to deliver up to 1650 W of continuous output power.
Read more...MPLAB PICkit Basic ASIC Design Services
Design Automation
To make its robust programming and debugging capabilities accessible to a wider range of engineers, Microchip Technology has launched the MPLAB PICkit Basic in-circuit debugger.
Read more...Accelerating RF PCB design in a 5G world ASIC Design Services
Editor's Choice Design Automation
Billions of IoT devices coming online in the coming years will require RF design capabilities that support ultra-fast 5G speeds.
Read more...NECTO Studio has been updated
Design Automation
NECTO Studio V7.1 IDE from MIKROE now includes full programmer and debug support for Microchip tools and also adds support for Microchip’s SAM MCU and STMicroelectronics’ STM32L4 series of ultra-low-power MCUs.
Read more...Powering the intelligent edge EBV Electrolink
AI & ML
STMicroelectronics released new devices from the second generation of its industrial MPUs, the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...QLC Flash memory using BiCS tech EBV Electrolink
DSP, Micros & Memory
KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell memory devices with its 8th-generation BiCS FLASH 3D flash memory technology.
Read more...Integrated POL voltage regulators EBV Electrolink
Power Electronics / Power Management
Infineon’s TDA38807 and TDA38806 are their highest density high-efficiency integrated point-of-load (IPOL) solutions for smart enterprise systems.