11 July 2012Manufacturing / Production Technology, Hardware & Services
Laird Technologies Thermal Products recently introduced its TflexT 300 series, the newest member of its Tflex family of thermally conductive gap fillers.
Tflex 300 is a highly compressible gap filler designed to provide excellent thermal performance while remaining cost effective for state-of-the-art computer and telecommunications applications. Providing the thermal transfer solution for heat issues that occur in high-speed devices, gap fillers such as Tflex 300 are critical to ensuring component and device performance integrity.
The Tflex 300 series has a thermal conductivity of 1,2 W/mK, and its ultra-soft interface pad conforms well with minimal pressure, resulting in little or no stress on adjoining parts. Its compliancy is complemented with very low compression set, enabling re-use of the same pad many times during rework.
The gap filler is naturally tacky and does not need an additional adhesive coating that could inhibit thermal performance and increase cost. Tflex 300 can be supplied with a permanently attached metallised liner, which improves the material’s ease of use. This liner also provides a low-friction surface for simpler rework and assembly. It is available in thicknesses of 0,25 mm to 5,08 mm and is electrically insulating.
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