EBV Electrolink

Tel: +27 11 236 1900
Email: [email protected]
www: www.ebv.com
more information about EBV Electrolink

Powering the intelligent edge
29 November 2024, EBV Electrolink, AI & ML

STMicroelectronics released new devices from the second generation of its industrial MPUs, the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
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QLC Flash memory using BiCS tech
29 November 2024, EBV Electrolink, DSP, Micros & Memory

KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell memory devices with its 8th-generation BiCS FLASH 3D flash memory technology.
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Integrated POL voltage regulators
29 November 2024, EBV Electrolink, Power Electronics / Power Management

Infineon’s TDA38807 and TDA38806 are their highest density high-efficiency integrated point-of-load (IPOL) solutions for smart enterprise systems.
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UFS Flash named Best in Show
29 November 2024, EBV Electrolink, News

KIOXIA Europe GmbH was named as winner in the Memory & Storage category of the Embedded Computing Design (ECD) electronica Best in Show Awards at the recently held electronica 2024.
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The power of UWB
29 November 2024, EBV Electrolink, Editor's Choice, Telecoms, Datacoms, Wireless, IoT

Ultra-Wideband, the robust wireless communications technology commonly known as UWB, is such a versatile technology, capable of doing so many different things, that it can be hard to categorise.
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Trimension family secures car access
29 November 2024, EBV Electrolink, Telecoms, Datacoms, Wireless, IoT

The Trimension NCJ29Dx family is part of NXP’s portfolio of secure car access system solutions, which includes the NCF3340 NFC controller and the KW37 Bluetooth 5.0 Long-Range MCU.
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Entry-level MCU with classical peripherals
30 August 2024, EBV Electrolink, DSP, Micros & Memory

NXP’s MCX C04x microcontrollers feature an Arm Cortex-M0+ core up to 48 MHz and offer 32 KB Flash, 2 KB SRAM, and 8 KB boot ROM.
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QLC Flash memory with the latest BiCS technology
31 July 2024, EBV Electrolink, Analogue, Mixed Signal, LSI

KIOXIA has implemented the groundbreaking CBA (CMOS directly Bonded to Array) technology, which enables the creation of higher density devices and an industry-leading interface speed of 3,6nbsp;Gbps.
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Webinar: Game-changing Matter standard
30 April 2024, EBV Electrolink, Telecoms, Datacoms, Wireless, IoT

Join Infineon for an exclusive one-hour webinar with EBV Elektronik, exploring the groundbreaking Matter standard, and its profound implications for the future of smart homes.
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General-purpose MCU with RISC-V architecture
30 April 2024, EBV Electrolink, DSP, Micros & Memory

Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.
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AI-native IoT platform launched
30 April 2024, EBV Electrolink, AI & ML

These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.
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Serial SRAM up to 4 MB
30 April 2024, EBV Electrolink, DSP, Micros & Memory

The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.
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