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www: | www.icorptechnologies.co.za |
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The EG810M series is a series of LTE Cat 1 bis wireless communication modules specially designed by Quectel for M2M and IoT applications.
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Powered by a Qualcomm processor, Quectel’s new SC200V is designed to deliver exceptional performance across system capabilities, multimedia functions, and network connectivity.
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The SGM621B is a high accuracy, high voltage instrumentation amplifier, which is designed to set any gain from 1 to 10 000 with one external resistor.
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The EG810M series is a series of LTE Cat 1 bis wireless communication modules specially designed by Quectel for M2M and IoT applications.
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With the evolution of Bluetooth, chips, sensors and other technologies, the design of TWS earphones is becoming smaller and thinner, and the performance and size requirements of integrated inductors need to follow suit.
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The increased demand for computing power in data centres has resulted in the development of multi-phase ultra-low profile, ultra-high current copper magnetic co-fired power inductors.
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The FGM840R has a built-in Cortex M33 and M23 dual-core processor and supports IEEE 802.11a/b/g/n protocol and BLE 5.0.
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The ESP32-C6 has achieved Thread 1.4 Interoperability Certification, offering secure commissioning, advanced diagnostics, enhanced internet connectivity with Thread over Infrastructure, and optimised energy-efficient device roles.
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LTE or 4G are now well-established as the go-to cellular technology for IoT but there is an enormous middle ground for LTE Cat 1 to serve, along with Cat 4 and other variants.
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iCorp has emerged as a force to be reckoned with amongst the electronic component distribution players and, since its inception, has migrated from being a broad-based supplier to a more focused electronic component distributor.
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The FGH100M-H Wi-Fi HaLow module is a long-range, low-power module from Quectel, compliant with the IEEE 802.11ah standard.
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Espressif Systems announced its latest SoC, the ESP32-P4 which is powered by a RISC-V CPU, with an AI instructions extension, an advanced memory subsystem, and integrated high-speed peripherals.
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