BTU’s Pyramax family of high-throughput convection reflow ovens provide excellence for SMT solder reflow, semiconductor packaging and LED packaging and assembly.
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Mycronic’s MY300 series delivers SMT pick-and-place at next level precision and flexibility in a fast, small and smart format.
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If the Automated Optical Inspection process is not perfectly controlled and adequately tailored to your SMT process, a significant number of false defects may appear in production.
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With a focus on precision, consistency, and efficiency, the Aurora platform sets a new standard for thermal processing in electronics manufacturing.
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Whilst many people understand the basic concepts of electrostatic discharge (ESD), and as a result insist on a properly equipped ESD Protected Area (EPA), it is then forgotten about.
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Mycronic has developed a unique two-step strategy to combat AOI false calls, based on two innovations.
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The MYC50 from Mycronic is a high-performance conformal coating system that ensures non-stop throughput across a range of high-volume applications.
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Foam is a common issue in the electronic cleaning world, and this article lists the common issues and solutions to preventing foam build up.
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The recently announced MYPro S series is a robust, highly accurate and user-friendly stencil printer that has been designed with all the functionalities expected from a modern screen printer.
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The MYPro A40DX pick-and-place machine from Mycronic boasts 48% higher speeds than the previous generation, and delivers high accuracy and fast changeovers.
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BTU International has introduced its latest innovation, the Aurora 200N – the longest and most advanced reflow oven ever produced by BTU – which sets a new standard for speed, efficiency, and flexibility.
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Although low-cost, the Pilot is offered with the ability to run the highly flexible Pillarhouse AP nozzle technology, together with its patented market leading 1,5 mm Micro Nozzle.
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