Cobar's XM-5 Series no-clean solder paste utilises a new polymer system that gives the paste unparalleled thermal stability, even under the demanding conditions and high temperatures associated with lead-free ...
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In a recent interview with SMT Magazine's Publisher's Executive Council, DEK USA President Richard Heimsch shares his expertise and insights, and describes how DEK has become and remained a leader in ...
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Designed for fast, efficient cleaning of surface mount stencils and screening equipment, DEK says its nonabrasive fabric, pre-saturated with hydro-treated naphtha, effectively cleans most commercially ...
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By combining ERSA's PL 500 A and IR 500 A, these two systems offer and extremely precise, flexible and cost-effective solution for modern SMD rework demands. In addition to BGA, mBGA and fine pitch components, ...
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"Our plans to grow the business include additional manufacturing sites in the USA and Asia, scheduled to open later this year."
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The ERSA TT 500 A is a table-top convection oven for universal reflow jobs in the prototype and small scale production. The closed heating chamber, the combined convection and quartz emitter heating ...
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"The modified ProFlow scheme offered a way of filling the glass grooves without altering the formulation of the phosphors."
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"The challenge now for IPC is to facilitate advancement through world-class educational and technical programs, and to establish relevant, usable and accessible standards that enable our industry to work and move forward together," says Ian McEvoy
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The marriage of a fine pitch placement machine and a chipshooter offers economic and productivity advantages. There is a movement underway that could shape the way assembly lines look in the future. ...
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General trends impacting the marketplace can be summarised in terms of component miniaturisation, rising functionality and lower costs
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DEK's FormFlex replaces programmable and manual tooling with a pin array that automatically conforms to the board underside. The result, it says, is shorter set-up time and enhanced support, especially ...
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With electronic assemblies becoming increasingly dense, and packages and substrates smaller than ever, electronics manufacturers are looking for the ultimate in precision material deposition. Zetech explains ...
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