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more information about Test & Rework Solutions |
The Inspex HD 1080p is Ash Technologies’ most advanced Inspex inspection system to date. Building on the success of the Inspex HD 720p, it boasts two core new features. The first, as suggested by the
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Metcal has added a solder ball placement kit to its convection rework accessory range. The company has developed a technique and identified a selection of tools that enable operators to rework small components
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Board profiling for production versus rework
If we consider profiling a PCB (printed circuit board) for reflow in production, we are generally concerned with achieving an even delta-T (ΔT) across all
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BoardMaster 8000 PLUS is a self-contained printed circuit board (PCB) test system from ABI Electronics. It comprises a comprehensive set of test instruments, complete with built-in Windows PC, for testing
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Steadily increasing requirements regarding lead times and variability demand ever more versatile, highly flexible SMT production solutions. Essemtec, the Swiss manufacturer of SMT equipment, has developed
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CUBUS is a new storage tower from Essemtec featuring user-adjustable shelves that can be varied in 5 mm steps and are auto-configured. Reels thus range from 8 to 72 mm and are easily accommodated. Moreover,
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Metcal premiered a new soldering and rework system, as well as a new hot air pencil, at last year’s productronica trade fair in Munich, Germany.
The updated MX-500 soldering and rework system builds
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Nordson YESTECH débuted its new FX-940 AOI inline PCB inspection system at this year’s IPC APEX Expo in Las Vegas.
This is the company’s latest automated solution for the inspection of solder defects,
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Virtual Industries has released the TV-1000-SP8-BD-220 vacuum handling tool for parts as small as 100 microns. The compact unit plugs directly into 220 V 50/60 Hz and can handle a wide variety of optics,
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Nordson YESTECH’s new high-speed FX SL AOI inspection system for populated printed circuit boards offers high-speed ‘capture on the fly’ inspection and utilises a flexible and comprehensive set of inspection
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Techcon Systems has introduced the TS9200D series jet tech valve with a unique diaphragm design. A single, easily replaceable diaphragm eliminates dynamic fluid seals found in other jets, meaning users
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Micro ball grid array packages (µBGA) are rapidly becoming the package of choice when designing new printed circuit board (PCB) assemblies. These packages generally offer high, first-pass process yields
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