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Next-gen 3D AOI system
EMP 2023 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services

Saki Corporation has developed the new 3Di series of high-speed, high-precision, next-generation in-line 3D automated optical inspection (3D AOI) systems for complex inspection of high-density printed circuit boards.
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Flux-cored wire earns new product award
23 November 2022, News

Indium Corporation has earned the Circuits Assembly New Product Introduction (NPI) Award for its flux-cored wire, CW-818.
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Indium Corporation earns BISinfotech BETA award
23 November 2022, News

Indium has earned a BISinfotech BETA award as global leader in the solder and materials category, making it the third consecutive year Indium has received a BETA award.
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Versaflow One – the One for everyone
26 October 2022, Manufacturing / Production Technology, Hardware & Services

Even with its compact dimensions and attractive price, this inline selective soldering machine does not require the user to make any compromises in terms of quality and throughput.
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Choosing a Pb-free solder paste
26 October 2022, Manufacturing / Production Technology, Hardware & Services

With all the different Pb-free solder pastes on the market today, how does anyone choose the correct solder paste that will ensure finished goods reliability?
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Indium announces new supercooled BiSn solder paste
28 September 2022, Manufacturing / Production Technology, Hardware & Services

Using SAFI-Tech’s platform, liquid metal is encapsulated in a proprietary soft shell, keeping the solder alloy in a sub-cooled (liquid) state far below its normal melting/freezing point.
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Indium expert to present on high-reliability alloy technologies
28 September 2022, Manufacturing / Production Technology, Hardware & Services

: Indium Corporation will share its industry knowledge and expertise on topics including high-temperature lead-free solder pastes for power discrete applications, and low-temperature solder pastes for wafer-level packaging applications.
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Webinar: Fundamentals of flip-chip bonding
31 August 2022, Manufacturing / Production Technology, Hardware & Services

Common failure modes in flip-chip assembly will be touched on, as well as how material advancements have allowed for and will continue to push new technology in flip-chip bonding.
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Indium receives award for microdispensing paste
31 August 2022, News

Indium Corporation earned Electronics Manufacturing World’s innovation award for Indium12.8HF, a versatile solder paste engineered to deliver exceptional jetting and microdispensing performance.
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Panasonic’s next generation NPM-WX
27 July 2022, Manufacturing / Production Technology, Hardware & Services

The NPM-WX, the latest generation of the NPM platform, is the perfect solution for the expanding and digital future in electronics assembly.
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Indium to showcase GalliTHERM liquid metal technology
27 July 2022, Manufacturing / Production Technology, Hardware & Services

Indium Corporation will be showcasing its GalliTHERM liquid metal technology together with its no-clean semiconductor flux at SEMICON to be held in Taiwan.
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Indium earns Allegro MicroSystems excellence award
27 July 2022, Manufacturing / Production Technology, Hardware & Services

Indium Corporation has earned an excellence award from Allegro MicroSystems for the efforts of its Asia-Pacific operations in delivering quality, on-time products during the 2021 fiscal year.
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