Panasonic has now started accepting orders for its newest modular mounter NPM-GW. This mounter is designed to enhance production lines with the end goal of having a fully functioning autonomous factory.
read more

With predictive and targeted maintenance options to maximise uptime, the NPM-GH from Panasonic is the first step to a truly autonomous factory.
read more

The two new probes have a larger diameter to provide better contact reliability.
read more

MIRTEC has signed a global partnership agreement with Siemens Digital Industries Software to integrate Siemens’ Valor Process Preparation software with its AOI and SPI machines worldwide.
read more

Optimising parts such as cameras and processed image data, and coordinating each component’s operation, are vital to a correctly functioning high-speed system.
read more

Lead-free tin-silver-copper (SnAgCu), also known as SAC, has been a popular solder alloy choice for surface mount technology (SMT) assembly in the electronics industry, but its adoption for automotive applications has proved to be challenging for several reasons.
read more

Indium Corporation has introduced Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.
read more

To capture smaller leads and posts in dual-level testing, QA’s new self-cleaning 55 steel crown tip style is now available in a 0,400-inch long stroke 075-40 and X50-40 probe series.
read more

With predictive and targeted maintenance options to maximise uptime, Panasonic’s NPM-GH pick-and-place machine is the first step to a truly autonomous factory.
read more

MIRTEC’s upcoming inspection system will include two of its patent pending technologies to provide unparalleled performance, ART’s exclusive optical systems, and TAL 3D SCAN’s laser scanner.
read more

Indium Corporation has introduced a new jetting solder paste, the PicoShot NC-6M, which is a no-clean, halogen-free, Type 6 powder-size material.
read more

Compared to standard preforms, these gold-based PDA preforms offer a higher level of precision to reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications.
read more