MB Silicon Systems

Tel: +27 11 728 4757
Email: [email protected]
www: www.mbsiliconsystems.co.za
more information about MB Silicon Systems

FRAM-based processor companion chip offers benefits
1 November 2006, DSP, Micros & Memory

Ramtron's FM3130 is a 64 kilobit, 3 volt FRAM-Enhanced processor companion product that combines the benefits of nonvolatile ferro-electric RAM with an integrated realtime clock/calendar (RTC) in one ...
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FRAM offers more data space in same footprint
18 October 2006, DSP, Micros & Memory

Ramtron's new FM25L512 is a 512 kilobit, 3 V nonvolatile FRAM device with a high-speed serial peripheral interface (SPI). It offers increased data collection and storage capacity in a small 8-pin package ...
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Transient suppressor in tinier case
6 September 2006, Circuit & System Protection

Central Semiconductor's CMF5.0A series transient voltage suppressors (TVS) are now available packaged in the SOD-123F surface mount case. The series includes reverse stand-off voltages from 5,0 V to 170 ...
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Family of general purpose I/O expanders
23 August 2006, Analogue, Mixed Signal, LSI

Catalyst Semiconductor has expanded its product lines to include a new family of I/O bus expanders. The first two devices in the family, the CAT9554 and CAT9554A, provide a simple and cost-effective method ...
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USB-UART bridge is well integrated
17 May 2006, DSP, Micros & Memory

Future Technology Devices International (FTDI) has unveiled the next generation of its USB-UART bridge family, the FT232R. This device includes onboard EEPROM, as well as a master clock generator, 3,3 ...
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1 A Schottky rectifiers now in small flat lead package
19 April 2006, Power Electronics / Power Management

Central Semiconductor has released its new CMMSH1 series of 1,0 A Schottky rectifiers in the flat lead SOD-123F surface mount package. This new series has peak repetitive reverse voltages of 20 V (CMMSH1-20), ...
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Power conversion ICs now in SMD-8B package
22 March 2006, Power Electronics / Power Management

Power Integrations has added two more members to its TOPSwitch-GX, high-voltage power conversion IC family. The 8-pin surface mount DIP (SMD-8B) packaged TOP245G and TOP246G devices can be dropped into ...
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Power conversion ICs enable 36 W power supply designs
22 February 2006, Power Electronics / Power Management

Power Integrations has added a new family of power conversion ICs to its line: the TinySwitch-III. These new devices (TNY274-TNY280) are capable of delivering up to 36,5 W of continuous power without ...
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General purpose rectifiers in small footprint package
8 February 2006, Power Electronics / Power Management

Central Semiconductor has released a series of 1,0 A general purpose rectifiers in the flat lead SOD-123F surface mount package. The new CMMR1 series of devices have peak repetitive reverse voltages of ...
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Dual pair Schottky diode package
8 February 2006, Power Electronics / Power Management

Central Semiconductor has released a dual pair of low VF Schottky diodes packaged in a space-saving SUPERmini SOT-26 surface mount case. The new CMXSH2-4LS device consists of two pairs of low VF Schottky ...
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IDE offers embedded designers greater flexibility
30 November 2005, Design Automation

The latest release of Cyan Technology's CyanIDE Integrated Development Environment (IDE) enables users to configure their design for either of Cyan's eCOG 1k and µCOG 1m low power 16-bit microcontrollers. ...
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Record function density for microcontroller
16 November 2005, Electronics Technology

Cyan Technology announced that its 16-bit Flash μCOG1m microcontroller packs more functionality into its ultra-small package than any comparable product on the market. The product, housed in an 8 mm square, ...
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