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Skyworks has introduced the SKY85772-11, a new addition to its family of front-end modules (FEMs) that are designed for growing retail, carrier and enterprise Wi-Fi 6 applications. The 5 GHz FEM offers
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Renesas Electronics recently launched the RL78/G14 fast prototyping board – a low-cost, function-rich board to enable rapid product development for IoT endpoint equipment.
The company also introduced
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Renesas Electronics unveiled the Renesas Advanced (RA) family of 32-bit Arm Cortex-M microcontrollers (MCUs).
They deliver a combination of optimised performance, security, connectivity, peripheral
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Renesas Electronics announced five new 8,2 mm creepage photocouplers that are the world’s smallest isolation devices for industrial automation equipment and solar inverters. With a package width of 2,5 mm,
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Renesas Electronics recently announced the industry’s first single-chip synchronous buck and low dropout (LDO) regulator targeting low-power FPGAs, DDR memory and other digital loads for spaceflight payload
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Renesas Electronics expanded its range of embedded artificial intelligence (e-AI) solutions for incorporating AI into embedded systems by bringing intelligence to endpoints. Its RZ/A2M microprocessor
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Renesas Electronics expanded its range of embedded artificial intelligence (e-AI) solutions for incorporating AI into embedded systems by bringing intelligence to endpoints. Its RZ/A2M microprocessor
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Renesas Electronics announced four new RX651 32-bit microcontrollers (MCUs) supplied in ultra-small 64-pin BGA and LQFP packages.
The new lineup expands the RX651 MCU group with a 64-pin (4,5 x 4,5
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Renesas Electronics announced four new RX651 32-bit microcontrollers (MCUs) supplied in tiny 64-pin BGA (4,5 x 4,5 mm) and LQFP (10 x 10 mm) packages. The MCUs address advanced security needs for endpoint
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Sky5 LiTE, recently unveiled by Skyworks, is a fully integrated front-end solution for mass tier 5G cellular applications. The baseband agnostic platform supports up to 100 MHz bandwidth for 5G new radio
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Renesas’ new encapsulated hybrid digital power modules offer high power density and efficiency for advanced FPGAs, DSPs, ASICs and memory. The ISL8210M and ISL8212M feature power density of 115 mA/mm2
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Renesas Electronics introduced two touch-free user interface (UI) solutions to simplify the design of 2D and 3D control-based applications. Based on the company’s capacitive sensor microcontrollers (MCUs),
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