Webinar: Bob Willis

29 January 2020 Events

When: 10 February 2020 from 2:30 to 4:00 pm (UK time).

Duration: Between 60 and 90 minutes, including question and answer session.

Cost: £65

Register: www.dataweek.co.za/*jan20-bobwillis

Printed circuit boards outgas during soldering, causing solder voids, solder balls and other process problems. Outgassing can occur in wave, selective and reflow soldering and it’s important first to non-destructively test samples to find the root cause. It’s possible to test bare or assembled boards to examine the potential for failure and eliminate some of the popular misconceptions in the industry. There are some different methods which can easily be conducted in manufacture before proceeding to costly laboratory analysis and this webinar from Bob Willis shows you how to do it and the typical results you can find.

The ‘PCB Outgassing & How to Test Bare Boards or Assembled Boards’ webinar covers topics such as types of outgassing from vias, through-holes and solder masks; how to test your own samples in manufacture; test method procedures; types of defects and how they can appear with tin/lead and lead-free alloys; void formation in wave, selective and PIHR joints; and correct specification of your boards.

After the webinar there is a Q&A; session for all delegate questions to be answered; however, if a delegate has a process example they would like covered in the webinar, it will need to be provided in advance of the session.

http://www.bobwillis.co.uk

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