Xilinx began shipping Versal AI Core series and Versal Prime series devices to multiple tier-one customers. Versal is the industry’s first adaptive compute acceleration platform (ACAP), a new category of heterogeneous compute devices with capabilities that exceed those of conventional CPUs, GPUs and FPGAs.
An ACAP is a highly integrated, multicore, heterogeneous compute platform that can be changed at both the hardware and software levels to dynamically adapt to the needs of a wide range of applications and workloads in data centre, automotive, 5G wireless, wired and defence markets.
Built from the ground up to be natively software programmable, the Versal ACAP architecture features a flexible, multi-terabit-per-second network-on-chip (NoC). The NoC seamlessly integrates all engines and key interfaces, making the platform available at boot and easily programmed by software developers, data scientists and hardware developers alike.
Through a host of tools, software, libraries, IP, middleware and frameworks, ACAPs enable dynamically customisable accelerated computing solutions through industry-standard design flows.
Webinar: Game-changing Matter standard EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
Join Infineon for an exclusive one-hour webinar with EBV Elektronik, exploring the groundbreaking Matter standard, and its profound implications for the future of smart homes.
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DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.
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AI & ML
These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.
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DSP, Micros & Memory
The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.
Read more...Microchip expands its mSiC solutions EBV Electrolink
Power Electronics / Power Management
The highly integrated 3,3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration.
Read more...Powering up the intelligent edge EBV Electrolink
DSP, Micros & Memory
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Read more...Flash for AI EBV Electrolink
AI & ML
SCM offers a midway latency point between DRAM and SSDs, and when coupled with the introduction of CXL, low-latency flash, such as XL-FLASH, is well-positioned to deliver improvements in price, system performance, and power consumption to everything from servers to edge devices deploying the power of AI.
Read more...UFS Ver. 4.0 embedded Flash memory devices EBV Electrolink
Computer/Embedded Technology
KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.
Read more...InnoSwitch5 Offline Flyback Switcher IC EBV Electrolink
Power Electronics / Power Management
ero-voltage switching (ZVS) flyback topology and advanced SR FET control enable 95% efficiency, together with reduced power supply size and component count.
Read more...IGBT power module EBV Electrolink
Power Electronics / Power Management
The company has now released its new half-bridge IGBT power modules offered in its redesigned INT-A-PAK package.
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