56 G MezzaWave connectors and cable assemblies

31 August 2026 Interconnection

Engineered to deliver notable signal integrity, TE’s high-speed, high-density 56 G MezzaWave connector family is built on an open-pin-field array platform that supports data rates up to 56 Gbps PAM4 for next-generation modular systems.

The series provides design flexibility with a 1,27 mm pitch option, pin counts ranging from 80 to 560, and 7-10 mm stack heights. It also features drop-in compatibility, enabling the direct replacement of existing components without redesign.

By combining advanced ball grid array (BGA) technology with a ruggedised mechanical design, MezzaWave connectors reliably support high-speed data transmission and are rated for up to 1000 mating cycles and a wide operating temperature range from -55°C to 125°C. These connectors meet

VMEbus International Trade Association (VITA) and American National Standards Institute (ANSI) standards and provide superior routing and grounding flexibility for optimised system performance.

For more information contact Electrocomp, +27 11 458 9000, sales@electrocomp.co.za, www.electrocomp.co.za

Further reading:

4 mm pitch power connectors
Spectrum Concepts Interconnection
Mill-Max has introduced a new line of high-reliability, 4 mm (.157”) pitch sockets and headers designed for power connections and rugged field applications.

Read more...

---

Space SMPM and SMPM-Lock connectors
Hiconnex Interconnection
Radiall has released the Space SMPM and SMPM-Lock, miniature Space connectors for high-frequency performance and high-density applications.

Read more...

---

Compact, high density, heavy duty, thermoplastic connectors
TRX Electronics Interconnection
Amphenol Sine Systems ATD series connectors, available from Mouser, are a compact, high density, heavy duty, thermoplastic solution with superior environmental seals and end caps for exceptional rear seal retention.

Read more...

---

Samtec supports SGeT oHFM.c with high-performance interconnects
Spectrum Concepts Interconnection
Samtec has announced a new product portfolio designed for the SGeT oHFM.c standard. These connectors are based on Samtec’s proven AcceleRate HD and AcceleRate HP high-density, high-performance product families.

Read more...

---

Connectivity solutions for hydrogen technologies
Hiconnex Interconnection
As the production distribution and utilisation of hydrogen continue to scale, connectivity becomes a key enabler for efficient energy transmission, data communication, and system control.

Read more...

---

Mixed-density Combo-D connectors
Hiconnex Interconnection
Positronic’s SCBM connector series is a rugged, high-performance family of mixed-density D-sub connectors engineered for demanding environments.

Read more...

---

Same Sky expands rectangular connector portfolio
Future Electronics Interconnection
The portfolio includes male pin headers, female pin headers, and box headers, giving engineers the flexibility to select the most appropriate connector style for their specific design requirements.

Read more...

---

Rugged USB-C for modern designs
Interconnection
Same Sky has expanded its USB Type-C connector portfolio to meet the growing demand for faster data transfer and higher power delivery in modern electronic designs.

Read more...

---

Designing with PCIe
Spectrum Concepts Editor's Choice Interconnection
PCI Express has become the backbone of modern high-performance systems with each new generation promising higher bandwidth, but that performance comes with a cost.

Read more...

---

Robust single-pole power connectivity
Hiconnex Interconnection
Designed for cable-to-cable and cable-to-equipment use, Radiall’s single-pole power connector support current ratings from 250 A to 750 A and operating voltages up to 1000 V AC or DC.

Read more...

---