31 July 2026
Manufacturing / Production Technology, Hardware & Services
With silver price volatility increasing and sustainability requirements accelerating across semiconductor assembly, MacDermid Alpha Electronics Solutions introduces ATROX CD 560-1, a zero per- and polyfluoroalkyl substance (PFAS) alternate silver filler die attach paste designed for metal leadframe packages and high-speed automated dispensing in modern manufacturing environments.
As silver prices continue to fluctuate sharply, semiconductor manufacturers face growing pressure on assembly budgets and long-term planning. ATROX CD 560-1 addresses this challenge through an engineered alternate silver filler approach that supports more stable cost management, while delivering reliable performance and production efficiency.
The paste is formulated to support high-speed, high-volume manufacturing, offering 2,5 watts per meter-kelvin (W/mK) bulk thermal conductivity and robust die attach performance across key metal leadframe surfaces, including pre-plated frames (PPF), commonly nickel-palladium-gold (NiPdAu), and copper leadframes. Consistent dispensing performance supports repeatable flow and dispense patterns, along with clean deposits across long production runs with minimal maintenance.
ATROX CD 560-1 is manufactured with no added per- and polyfluoroalkyl substances (PFAS). The zero PFAS chemistry aligns with broader sustainability goals without slowing production or adding process complexity.
The paste is compatible with time-pressure pump systems used on most die bonders, allowing consistent dispensing over long production runs. Low outgassing helps maintain cleaner oven environments and supports strong package reliability in downstream processes. Flexible cure options include snap cure for fast production lines and box-oven cure for conventional manufacturing flows, both delivering consistent results.
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