WAVEPIA, an RFIC/MMIC design house based in Korea, designs and develops RF GaN HEMT bare dies and RF GaN transistors, which are customisable based on customer’ requirements. They provide devices and RF solutions named High Power GaN PLL and have solutions that operate up to 40 GHz and up to several hundred Watts.
The company has now released their latest GaN-on-SiC transistor, the WP2806015UH(S), that delivers 15 W from DC to 6 GHz at 28 V. This unmatched GaN transistor targets applications in electronic warfare, jamming, military communications, and data links.
Strategic agreement for eSIM solutions Avnet Silica
Telecoms, Datacoms, Wireless, IoT
This agreement between Avent Silica and Thales covers the latter’s eSIM solutions that are compliant with GSMA SGP.22 and SGP.32 standards.
Read more...High precision multi-GNSS antenna RS South Africa
Telecoms, Datacoms, Wireless, IoT
The Amphenol PCTEL GNSS-L125-DH-NF multi-GNSS antenna is a high-performance antenna designed for reliable global navigation satellite system reception in demanding environments.
Read more...Designing IoT devices for deterministic LPWAN environments
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Built on Ultra Narrow Band communication technology, the Sigfox network focuses on low power, wide area M2M connectivity rather than maximising data throughput.
Read more...Robust LoRaWAN for distributed IoT CST Electronics
Telecoms, Datacoms, Wireless, IoT
InHand Networks has unveiled its latest LoRaWAN gateway, the EC312, marking an evolution in industrial-grade connectivity solutions for distributed IoT environments.
Read more...GigaDevice expands GD25UF Series density NuVision Electronics
DSP, Micros & Memory
GigaDevice has announced the expanded density range of its GD25UF series 1,2 V ultra-low power SPI NOR Flash, now spanning from 8 Mb to 256 Mb.
Read more...Miniaturised tuneable harmonic filter bank RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
Modern RF and microwave communication systems require compact, high power filtering solutions to suppress unwanted harmonic signals generated by power amplifiers, and to address this challenge, Tri-TeQ has developed a miniaturised broadband tuneable harmonic switched filter bank.
Read more...Nordic accelerates cellular IoT leadership RF Design
Telecoms, Datacoms, Wireless, IoT
The company unveiled its next-generation portfolio featuring Cat 1 bis, satellite NTN, and advanced LTE-M/NB-IoT with edge AI, delivering secure and resilient connectivity across billions of IoT devices.
Read more...Powering the future of industrial automation IOT Electronics
Telecoms, Datacoms, Wireless, IoT
5G, the 5th generation of wireless broadband technology, enables users to establish reliable connectivity, which in turn enables flexible, autonomous, and efficient processes from production to logistics.
Read more...Wi-Fi 7 tri-band connectivity module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel has introduced the FCE870Q, a compact short range wireless connectivity module designed for next generation IoT devices that require high throughput, low latency, and reliable operation in dense wireless environments.
Read more...Compact cellular IoT SiP with GNSS RF Design
Telecoms, Datacoms, Wireless, IoT
Combining low-power connectivity, edge processing, and positioning capabilities in a compact module, Nordic’s nRF9151 targets applications such as asset tracking, smart metering, industrial monitoring, and smart city infrastructure.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.