Samtec Full Line Catalog
17 May 2006
Technical Literature
Samtec has released its new F-206 Full Line Catalogue with 350 pages of applications, specifications, and ordering information on panel-to-panel, panel-to-board, cable-to-board, and board-to-board interconnect systems. Applications are detailed by signal integrity interconnects and services, rugged board level interconnects, I/O, RF, cable systems, and micro board-to-board interconnects. New high speed products include an expanded line of data rate single-ended coax and differential pair twinax panel-to-panel and board-to-board cable assemblies, new edge rate connectors on 0,8 mm pitch, and TNC, BNC, SMA, and N-type RF connectors and cables. The high density array family has been expanded to include right angle designs for DPArray differential pair arrays. Other new products include one piece, micro card, and combination signal-power interfaces.
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