NXP’s IW610 wireless chip solution features a 1x1 dual-band (2,4/5 GHz) Wi-Fi 6 radio subsystem, offering improved network efficiency, reduced latency and extended range compared to previous Wi-Fi standards. Its Bluetooth LE radio supports a high-speed data rate of 2 Mbit/s, along with long-range communication and extended advertising for network commissioning and sensor aggregation. The IW610 family supports both dual and single-antenna configurations, ensuring efficient coexistence between internal and external radios.
Incorporating NXP’s EdgeLock security technology, the IW610 provides robust protection for secure boot, firmware updates and lifecycle management. Its advanced design delivers tight integration, low power consumption and secure operation, all in a compact, cost-efficient package.
The IW610 is compatible with NXP’s i.MX MPUs, i.MX RT and MCX host platforms. Its modular host driver architecture allows for easy integration with other MCUs and MPUs with minimal effort. It offers multiple interfaces for connecting to external processors, including SDIO and USB for Wi-Fi, UART or USB for Bluetooth and SPI for 802.15.4.
SMT-mountable card connectors
Telecoms, Datacoms, Wireless, IoT
Würth Elektronik introduces four new SMT-mountable Nano SIM and microSD card connectors and expands its range with solutions for the smallest packages.
Read more...Module for smart city and smart utility devices iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has launched the Quectel KCM0A5S, a high-performance Wi-SUN module designed for smart applications such as street lighting, precision agriculture, industrial IoT, smart meters and smart cities.
Read more...Ultra-low-power wireless module Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The STM32WBA5MMG from STMicroelectronics is an ultra-low-power, small form factor, certified 2,4 GHz wireless module that supports Bluetooth LE, Zigbee 3.0, OpenThread, and IEEE 802.15.4 proprietary protocols.
Read more...MCX C Series development board Avnet Silica
DSP, Micros & Memory
The FRDM-MCXC444 is a compact and scalable development board for rapid prototyping of MCX C444 MCU from NXP Semiconductors.
Read more...Quectel partners with GEODNET Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has partnered with GEODNET to deliver Quectel’s Real-Time Kinematic (RTK) correction services, enabling high-precision positioning for IoT applications.
Read more...Bringing Bluetooth Channel Sounding to automotive and beyond with KW47 Altron Arrow
Telecoms, Datacoms, Wireless, IoT
NXP’s new Channel Sounding-certified KW47 and MCX W72 wireless MCUs are set to help automakers with distance measurement, bringing an additional ranging solution for car access and autonomous systems, and will be utilised across a broader spectrum of applications.
Read more...Dual-band GNSS antenna RF Design
Telecoms, Datacoms, Wireless, IoT
The Taoglas Accura GVLB258.A, is a passive, dual-band GNSS L1/L5, high-performance antenna for high precision GNSS accuracy and fast positioning.
Read more...Cutting-edge hybrid capacitors Avnet Silica
Passive Components
Panasonic Industry recently announced the launch of the ZVU Series Hybrid Capacitors, a cutting-edge solution tailored to meet the escalating demands of advanced electronic systems.
Read more...What is Wi-Fi HaLow and why choose it for IoT? iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Wi-Fi HaLow introduces a low power connectivity option that, in contrast to other Wi-Fi options, offers greater range of approximately 1 km, which opens up a raft of IoT use cases.
Read more...Wi-Fi 6 and Bluetooth LE coprocessor module Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The ST67W611M1 from STMicroelectronics boasts an all-in-one design which, together with its capabilities, contribute to making it an attractive choice for IoT edge devices requiring a single-chip solution.
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