GlobalFoundries and Microchip Technology have announced that Microchip’s 28 nm ESF3 third-generation SuperFlash embedded flash memory solution is in production using GF’s 28SLPe foundry process. The widely deployed non-volatile memory (NVM) solution is optimised for microcontrollers, smart cards and IoT chips.
Use cases for embedded flash are exploding with the drive for increased intelligence at the edge. Embedded memory for secure code storage, over-the-air-updates and enhanced functionality is on the rise in a wide range of applications in home and industrial IoT. Smart mobile devices and innovative platforms are required to meet these needs.
“GF is proud to partner with SST to develop, qualify and release to production this impressive embedded NVM solution on our robust 28SLPe platform,” said Mike Hogan, chief business unit officer at GF. “GF’s customers are finding this combination of high performance, excellent reliability, IP availability and cost effectiveness to be ideal for advanced MCUs, complex smart cards and IoT chips for consumer and industrial products.”
“SST and GF have partnered closely over the last decade to integrate and productise SST’s industry-standard ESF1 and ESF3 embedded Flash technologies into GF’s 130 nm BCD, 55, 40, and now 28 nm foundry platforms,” added Mark Reiten, vice president of SST, Microchip’s licensing business unit. “We are excited by the leadership position GF is establishing for the broadest offering of embedded NVM solutions, and expect our close partnership to deliver additional breakthroughs over the coming decade.”
The 28 nm SuperFlash technology will deliver the following benefits:
• Lowest cost 28 nm ESF3 solution, including true 5 V IO CMOS devices.
• Highly competitive SST ESF3 bit cell size of less than 0,05 micron squared.
• Operating temperature rating of -40 to 125°C.
• Sub-25 ns read access times, 10 µs program times and 4 ms erase times.
QuecPython live demonstration Quectel Wireless Solutions
DSP, Micros & Memory
QuecPython allows designers to adapt Quectel’s modules quickly, with a low-code approach to suit their precise requirements in less time and at reduced cost, while maintaining high security standards.
Read more...Robust and customisable SBC Altron Arrow
DSP, Micros & Memory
Pairing the powerful i.MX8M Plus System on Module (SoM) from SolidRun, which features the i.MX 8M Plus SoC from NXP, this high-performance SBC is set to transform industrial environments.
Read more...New family supports future cryptography Altron Arrow
DSP, Micros & Memory
NXP has introduced its new i.MX 94 family, which contains an i.MX MPU with an integrated time-sensitive networking (TSN) switch, enabling configurable, secure communications with rich protocol support in industrial and automotive environments.
Read more...Fast and reliable 4G connectivity worldwide TRX Electronics
DSP, Micros & Memory
Powered by a powerful Quectel LTE Cat 4 modem, the Arduino Pro 4G module’s fast data throughput and high bandwidths ensure reliable and quick data download and upload, even in remote locations.
Read more...NXP’s all-purpose microcontroller series Altron Arrow
DSP, Micros & Memory
NXP has released its MCX A14x and A15x series of all-purpose microcontrollers which are part of the larger MCX portfolio that shares a common Arm Cortex-M33 core platform.
Read more...Powering the intelligent edge EBV Electrolink
AI & ML
STMicroelectronics released new devices from the second generation of its industrial MPUs, the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...ESP32-P4 SoC iCorp Technologies
DSP, Micros & Memory
Espressif Systems announced its latest SoC, the ESP32-P4 which is powered by a RISC-V CPU, with an AI instructions extension, an advanced memory subsystem, and integrated high-speed peripherals.
Read more...Microchip SoC FPGA ASIC Design Services
DSP, Micros & Memory
Microchip Technology introduced the RT PolarFire SoC FPGA, the first real-time Linux capable, RISC-V-based microprocessor subsystem on a proven RT PolarFire FPGA platform.
Read more...QLC Flash memory using BiCS tech EBV Electrolink
DSP, Micros & Memory
KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell memory devices with its 8th-generation BiCS FLASH 3D flash memory technology.
Read more...Integrated POL voltage regulators EBV Electrolink
Power Electronics / Power Management
Infineon’s TDA38807 and TDA38806 are their highest density high-efficiency integrated point-of-load (IPOL) solutions for smart enterprise systems.
printer friendly version