STMicroelectronics’ LPS22DF pressure sensor has received a NextNav certification, which guarantees performance and reliability for geolocation and other types of applications. The qualification thus delivers new assurances to an increasing number of makers needing precise vertical positioning information for regulatory or market reasons.
The device supports a maximum pressure of 1260 hPa, while only consuming 9,4 µA in high-performance mode. It has a unique full-moulded package to ensure dust and mould resistance. While traditional packages use a cavity, ST uses microscopic holes much smaller than the traditional 20 µm dust particles. Consequently, the device lets the air through, but isn’t sensitive to the degradation caused by dust thanks to the microscopic holes and a silicon cap protecting the sensing membrane. As a result, makers can use the device in many manufacturing settings without worrying about damage caused by dust particles.
The LPS22DF embeds a unique MEMS design that reduces the drift significantly and accelerates recovery after soldering. In certain settings, makers could even do away with a recalibration after the soldering process. Additionally, the LPS22DF’s design provides long-term stability by limiting the amount of drift over time.
Powering the intelligent edge EBV Electrolink
AI & ML
STMicroelectronics released new devices from the second generation of its industrial MPUs, the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...QLC Flash memory using BiCS tech EBV Electrolink
DSP, Micros & Memory
KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell memory devices with its 8th-generation BiCS FLASH 3D flash memory technology.
Read more...Integrated POL voltage regulators EBV Electrolink
Power Electronics / Power Management
Infineon’s TDA38807 and TDA38806 are their highest density high-efficiency integrated point-of-load (IPOL) solutions for smart enterprise systems.
Read more...Infineon launches Edge Ai software solution Altron Arrow
Analogue, Mixed Signal, LSI
Infineon has introduced DEEPCRAFT, a new software solution category brand for Edge AI and machine learning, after the company recognised the huge potential of Edge AI for the market.
Read more...UFS Flash named Best in Show EBV Electrolink
News
KIOXIA Europe GmbH was named as winner in the Memory & Storage category of the Embedded Computing Design (ECD) electronica Best in Show Awards at the recently held electronica 2024.
Read more...The power of UWB EBV Electrolink
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Ultra-Wideband, the robust wireless communications technology commonly known as UWB, is such a versatile technology, capable of doing so many different things, that it can be hard to categorise.
Read more...Trimension family secures car access EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The Trimension NCJ29Dx family is part of NXP’s portfolio of secure car access system solutions, which includes the NCF3340 NFC controller and the KW37 Bluetooth 5.0 Long-Range MCU.
Read more...16-bit voltage output denseDAC Altron Arrow
Analogue, Mixed Signal, LSI
The AD5766 uses a versatile four-wire serial interface that operates at clock rates of up to 50 MHz for write mode, and is compatible with SPI, QSPI, MICROWIRE, and DSP interface standards.
Read more...AFE enables the software-defined factory Avnet Silica
Analogue, Mixed Signal, LSI
With its software configurable analogue inputs, where each input can be configured for voltage, current, resistance, or temperature, NXP’s N-AFE enables a new level of flexibility.
Read more...Entry-level MCU with classical peripherals EBV Electrolink
DSP, Micros & Memory
NXP’s MCX C04x microcontrollers feature an Arm Cortex-M0+ core up to 48 MHz and offer 32 KB Flash, 2 KB SRAM, and 8 KB boot ROM.
printer friendly version