Powered by Qualcomm Technologies’ premium-tier SoC (System-on-Chip) QCS8250, the module is designed to meet the requirements of high-end AIoT scenarios such as HD video conferences, HD livestreaming, cloud gaming, edge computing, robotics, drones and AR/VR.
The combination of AI and IoT has opened up new possibilities for industries requiring automated real-time decision-making and data analysis. The demand for 5G AIoT solutions is expected to skyrocket, according to Counterpoint Research, with shipments of 5G AIoT modules reaching a CAGR of 84% between 2022 and 2030. Fibocom’s AI smart module is set to play a crucial part in the industry, with the potential to empower a massive range of compute-intensive use cases.
Equipped with the Qualcomm QCS8250 IoT solution, Fibocom’s AI smart module SCA825-W integrates an octa-core Kryo 585 CPU, Adreno 650 GPU, dedicated NPU 230 (Neural Processing Unit), as well as Hexagon DSP for machine learning. The module can deliver a computing power of up to 15 TOPS enabling complex AI computing performance with exceptional features.
Featuring a powerful Spectra 480 ISP (image signal processor), Adreno 995 DPU and Adreno 665 VPU, Fibocom SCA825-W supports up to seven concurrent cameras, triple 4K display and video encoding at up to 4K resolution at 120 fps and 8K at 30 fps, offering superior image capturing, processing and displaying capabilities.
The module supports 5G, Wi-Fi 6.0, Bluetooth 5.1 as well as 2x2 Wi-Fi MIMO multi-antenna technology, which allows various wireless connectivity options for industrial and commercial use cases. It also supports Android 10 operating system and a wide range of interfaces (MIPI-DSI, I2S, PCIe, UART, USB, I2C, SPI), enabling flexibility and ease of integration into AIoT applications.
“With AIoT continuously transforming every industry, high-performance AI modules will become an important pillar,” said Eden Chen, general manager of MC product management department, Fibocom. “Our newly-launched AI smart module SCA825-W is an exceptional part of the Fibocom smart module family, which will take a big step forward in the AIoT field with technological advancements.”
High visibility 4-digit panel ammeters Electrocomp
Enclosures, Racks, Cabinets & Panel Products
The MP-335PAS-1 is a 4-digit 7-segment red display ammeter with a measurement range of 4 to 20 mA and a very low power consumption.
Read more...KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Artificial intelligence meets embedded development Avnet Silica
DSP, Micros & Memory
Microchip Technology is leveraging the power of artificial intelligence (AI) to assist software developers and embedded engineers in writing and debugging code with the launch of its MPLAB AI Coding Assistant.
Read more...Embedded module for AI vision applications Rugged Interconnect Technologies
DSP, Micros & Memory
The TQMa95xxSA supports AI/ML with vision applications through an integrated NPU and an image processor unit.
Read more...High-speed Flash for SoC applications NuVision Electronics
DSP, Micros & Memory
GigaDevice has unveiled the GD25NE series of dual-power supply SPI NOR Flash chips, designed specifically for 1,2 V system-on-chip (SoC) applications.
Read more...Super-fast H.264 encoder FPGA core EBV Electrolink
DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.
Read more...ST MCUs extend ultra-low power innovation Altron Arrow
DSP, Micros & Memory
STMicroelectronics has introduced new STM32U3 microcontrollers with cutting-edge power-saving innovations that ease deployment of smart connected tech, especially in remote locations.
Read more...Chipset enables ultra-wide signal capture RFiber Solutions
DSP, Micros & Memory
Jariet Technologies has developed Electra, a chipset that enables ultra-wide, multi-function and multi-band signal capture and generation from a single component.
Read more...SoC for real-time AI at the edge Future Electronics
DSP, Micros & Memory
Ambiq’s Apollo330 Plus series is purpose-built to enable always-on and real-time AI inferencing on devices.
Read more...HiRel components from Kyocera AVX Electrocomp
Passive Components
Kyocera AVX Corporation is a leading supplier of advanced components and interconnect solutions, offering a broad selection of passive components and connectors.
printer friendly version