DSP, Micros & Memory


200 MHz MCUs backed by TrustZone security

24 November 2021 DSP, Micros & Memory

Renesas Electronics now offers a 200 MHz RA6E1 microcontroller (MCU) which uses a high-performance Arm Cortex M33 core and TrustZone. The device is built on a highly efficient 40 nm process and supported by an open ecosystem with the Flexible Software Package (FSP), which simplifies the implementation of communications and security.

The RA6E1 group is suitable for entry-level IoT applications and cloud gateways requiring streamlined feature and connectivity integration, including Ethernet and performance of 790,75 CoreMark, which amounts to 3,95 CoreMark/MHz. These new devices enable fast design cycles and easy upgrades to other RA family devices, comprising more than 150 parts ranging from 48 to 200 MHz with low power consumption, a wide range of communications options and security options including Arm TrustZone technology.

Key features of the RA6E1 MCU include the 200 MHz Arm Cortex M33 with TrustZone, a wide temperature range of -40°C to +85°C, scalable 48- to 100-pin package options, streamlined connectivity including Ethernet with MAC, USB 2.0 Full Speed, serial communication, CAN, SSI, SDHI and QSPI and hardware and software compatibility and scalability to the RA mainstream line or ASSP products and back.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

KIOXIA pioneer new 3D Flash technology
EBV Electrolink DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.

Read more...
Artificial intelligence meets embedded development
Avnet Silica DSP, Micros & Memory
Microchip Technology is leveraging the power of artificial intelligence (AI) to assist software developers and embedded engineers in writing and debugging code with the launch of its MPLAB AI Coding Assistant.

Read more...
Embedded module for AI vision applications
Rugged Interconnect Technologies DSP, Micros & Memory
The TQMa95xxSA supports AI/ML with vision applications through an integrated NPU and an image processor unit.

Read more...
High-speed Flash for SoC applications
NuVision Electronics DSP, Micros & Memory
GigaDevice has unveiled the GD25NE series of dual-power supply SPI NOR Flash chips, designed specifically for 1,2 V system-on-chip (SoC) applications.

Read more...
Super-fast H.264 encoder FPGA core
EBV Electrolink DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.

Read more...
ST MCUs extend ultra-low power innovation
Altron Arrow DSP, Micros & Memory
STMicroelectronics has introduced new STM32U3 microcontrollers with cutting-edge power-saving innovations that ease deployment of smart connected tech, especially in remote locations.

Read more...
Chipset enables ultra-wide signal capture
RFiber Solutions DSP, Micros & Memory
Jariet Technologies has developed Electra, a chipset that enables ultra-wide, multi-function and multi-band signal capture and generation from a single component.

Read more...
SoC for real-time AI at the edge
Future Electronics DSP, Micros & Memory
Ambiq’s Apollo330 Plus series is purpose-built to enable always-on and real-time AI inferencing on devices.

Read more...
Evaluation kit for ML applications
Future Electronics DSP, Micros & Memory
The hardware kit includes radar, acoustic, pressure and motion sensors and integrates dual Arm Cortex-M4 and Cortex-M0+ CPU cores.

Read more...
Microprocessors with advanced graphics and connectivity
Avnet Silica DSP, Micros & Memory
Microchip’s SAMA7D65 MPU runs a 1 GHz Arm Cortex-A7 core and integrates MIPI DSI, LVDS display interfaces and 2D GPU for HMI applications.

Read more...