Computer/Embedded Technology


NXP streamlines development with Microsoft Azure RTOS

29 April 2020 Computer/Embedded Technology

NXP Semiconductors expanded its partnership with Microsoft to bring Microsoft Azure RTOS, a comprehensive real-time operating system (RTOS), to a broader range of processing solutions from its EdgeVerse portfolio. The collaborative efforts will give NXP’s developer community using MCUXpresso software and tools seamless access to the capabilities of Azure RTOS, including fully integrated middleware and tools for file management, graphical user interface, security, networking and wired/wireless connectivity.

Currently, Azure RTOS support is available for many of NXP’s low-power, secure 32-bit LPC and i.MX RT crossover microcontrollers (MCUs). With this announcement, NXP intends to broaden its partnership and enable Azure RTOS from within its popular MCUXpresso software development kit (SDK), which will further expand support across its broader MCU portfolio. This turnkey integration will simplify nearly every step of the development cycle, such as choosing the right processor, developing and deploying secure, intelligent edge devices, building secure local area networks and connecting to the cloud.

NXP and Microsoft envision this collaboration will reduce production costs for developers and help them bring new industrial and IoT edge applications to market faster.

“The rapid adoption of edge processing has changed the landscape of operating systems for MCUs. The industrial and IoT edge of today requires embedded software that is anchored by small footprint RTOS, combined with comprehensive middleware stacks, which Azure RTOS provides,” said Joe Yu, vice president and general manager of microcontrollers at NXP. “We’re happy to complement the breadth of our MCUs with Azure RTOS for our customers to unlock the limitless possibilities of the intelligent edge and secure connected world.”


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Microsoft Windows IoT on ARM
Altron Arrow Computer/Embedded Technology
This expansion means that the Windows IoT ecosystem can now harness the power of ARM processors, known for their energy efficiency and versatility.

Read more...
General-purpose MCU with RISC-V architecture
EBV Electrolink DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.

Read more...
AI-native IoT platform launched
EBV Electrolink AI & ML
These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.

Read more...
Serial SRAM up to 4 MB
EBV Electrolink DSP, Micros & Memory
The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.

Read more...
Microchip expands its mSiC solutions
EBV Electrolink Power Electronics / Power Management
The highly integrated 3,3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration.

Read more...
Powering up the intelligent edge
EBV Electrolink DSP, Micros & Memory
STMicroelectronics is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.

Read more...
Hardened-grade network switches
CST Electronics Computer/Embedded Technology
Lantronix’s hardened switches provide Layer 2 or Layer 3 networking, and are available as Power-over-Ethernet (PoE) or Power-over-Ethernet Plus (PoE+).

Read more...
Switched mezzanine card for enhanced Ethernet connectivity
Rugged Interconnect Technologies Computer/Embedded Technology
The TXMC897 sets a new standard in high-speed Ethernet communication, with advanced features and flexibility.

Read more...
Flash for AI
EBV Electrolink AI & ML
SCM offers a midway latency point between DRAM and SSDs, and when coupled with the introduction of CXL, low-latency flash, such as XL-FLASH, is well-positioned to deliver improvements in price, system performance, and power consumption to everything from servers to edge devices deploying the power of AI.

Read more...
Ryzen V3000 computer on module
Altron Arrow Computer/Embedded Technology
SolidRun has recently announced the launch of its new Ryzen V3000 CX7 Com module, configurable with the eight-core/16-thread Ryzen Embedded V3C48 processor.

Read more...