Telecoms, Datacoms, Wireless, IoT


Review of Class AB high-power amplifiers

25 March 2020 Telecoms, Datacoms, Wireless, IoT

A Class AB amplifier is a highly used amplifier design for high-power RF applications, as well as other applications that require high power gain with minimal signal distortion.

The main benefit is that Class AB amplifiers are biased so that the output current flows for less than one full cycle of the input waveform, but for more than a half cycle of the waveform. An AB amplifier design allows for the multiple switching transistors in the complementary output stage to conduct an opposite half-cycle of the input waveform prior to combination at load.

This design results in minimised crossover distortion, in contrast to that of the Class B amplifier design, as both output transistors conduct for a short period of time each cycle during the zero crossover period. Hence, AB amplifiers have a conduction angle greater than 180 degrees and smaller than 360 degrees.

The benefit of this design is a much more efficient amplifier than a Class A amplifier, but which delivers better signal quality than a Class B amplifier, albeit less efficiently. With good bias control, the distortion associated with partial conduction amplifiers can be minimised in Class AB configurations.

In the case of RF amplification, Class AB amplifiers with excellent efficiency can be designed that have extremely wide bandwidths, high gain and high saturated output power levels. Class AB high-power amplifiers (HPAs) that reach 18 GHz are available with saturated power output levels reaching 10 Watts to 200 Watts. Depending on the technology, available Class AB HPAs can reach power added efficiency (PAE) of 40%.

Power level gains for these types of amplifiers range from 37 dB to 53 dB. Additionally, these amplifiers also often feature DC bias control, which is sometimes TTL logic controlled. Added features include current and temperature sensing functions for better bias compensation and monitoring, as well as heatsink enclosures with the ability to add cooling fans for better thermal management.

There are several common semiconductor technologies used to fabricate Class AB HPAs: vertically diffused metal oxide semiconductor (VDMOS), laterally diffused metal oxide semiconductor (LDMOS) and gallium nitride (GaN) transistors.

Essentially, the type of semiconductor technology used for a Class AB HPA depends on the frequency range of the amplifier. VDMOS HPAs generally operate efficiently below a few hundred megahertz, while LDMOS HPAs can be designed to be efficient to a few gigahertz, but are generally more efficient below one gigahertz. GaN HPAs, on the other hand, can be designed for applications in the tens of gigahertz with extremely high efficiency and gain, even at higher frequencies.

HPAs also feature various coaxial connector styles depending on the power and frequency of the amplifier. For HPAs that operate to several gigahertz, both SMA and N-type connectors are common, with N-type connectors being able to handle higher power than SMA. However, for higher-frequency applications beyond 10 GHz and below 200 Watts of power, SMAs are the most prevalent coaxial connector.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Module combines 5G and NTN support
Quectel Wireless Solutions Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions announced the launch of its BG770A-SN ultra-compact 5G-ready satellite communication module, compliant with 3GPP releases 13, 14 and 17.

Read more...
Scalable and secure IoT device onboarding and management
Telecoms, Datacoms, Wireless, IoT
EasyPass is an enhancement within Cambium’s cnMaestro platform, aimed at providing local businesses with secure, efficient, and scalable device management, making it ideal for high-demand environments such as educational institutions, retail spaces, and corporate campuses.

Read more...
3,75 GHz RF inductor
RF Design Passive Components
The ceramic chip wire wound inductor from Coilcraft features a DC resistance of 1 O, a DC current of 175 mA, and a self-resonant frequency of 3,75 GHz.

Read more...
SIMCom’s A7673X series
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
SIMCom’s A7673X series is a Cat 1 bis module that supports LTE-FDD, with a maximum downlink rate of 10 Mbps and an uplink rate of 5 Mbps.

Read more...
Non-terrestrial network module
Altron Arrow Telecoms, Datacoms, Wireless, IoT
Fibocom unveiled its MA510-GL (NTN), a non-terrestrial networks module which is compliant with 3GPP Release 17 standard.

Read more...
Cellular IoT connectivity via satellite
Altron Arrow Telecoms, Datacoms, Wireless, IoT
The Telit Cinterion cellular LPWA module will enable satellite data communication using the NB-IoT protocol, without any special hardware changes required for the integration of the cellular module in the customer application.

Read more...
Wireless module supports up to 600 Mbps
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel’s FCU865R is a high-performance Wi-Fi 6 and Bluetooth 5.3 LCC package module which can be used for WLAN and Bluetooth connections.

Read more...
Unlocking the future of connectivity
Telecoms, Datacoms, Wireless, IoT
The battle for the 6 GHz spectrum band is heating up in South Africa, mirroring global debates on the allocation of spectrum between Wi-Fi and cellular operators.

Read more...
Quectel wireless module wins accolade
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
The winners of the 2024 IoT Evolution 5G Leadership Award were recently announced, with Quectel walking away with an award for its modules which make 5G features more easily accessible for IoT applications, notably the company’s RG255C-GL.

Read more...
Innovative upgrade process for 2G/3G
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
What is likely to happen during the sunset period for 2G and 3G signals, especially on the back of already near-obsolescence of 2G network equipment, is for the availability of the connectivity mediums to begin to reduce between now and the shutdown date.

Read more...