Aries' TouchSpring socket is unique in the industry. The TouchSpring is a surface-mount socket designed to connect BGA, LGA or CSP devices on pitches 1 mm down to 0,5 mm for test, burn-in and prototype applications. This design uses a unique integral pressure pad which applies downward z-axis force onto a helical-shaped spring which is designed to 'cup' the solderball. This spring is secured within a custom interposer which allows for continuous contact force on the SMT PCB pads even when no chip is engaged.
These sockets are designed to maintain contact forces of 10 to 15 g throughout the entire test and burn-in cycle. They incorporate high-temperature plastic and gold-plated beryllium copper springs.
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