Interconnection


Sockets for DC test and burn-in applications

29 January 2003 Interconnection

The Aries CSP sockets for 'burn-in' applications are fitted with a special Aries spring-probe designed for over 200 000 cycles of DC testing and burn-in.

These sockets are designed for use by virtually any CSP type packages from 1 mm down to 0,5 mm lead spacings (including but not limited to, BGA, MLF and QFN types of packages). The socket bodies are moulded to form high-temperature engineering plastics which allow for quick delivery and very competitive pricing. Sizes up to 50 x 50 mm are available.



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