Electronics Technology


First 8051 C++ compiler launched

20 November 2002 Electronics Technology

This year Ceibo released the world's first C/EC++ compiler for one of the most popular microcontroller architectures: the 8051.

The newly designed Ceibo C/EC++ compiler, said to be the first product of its kind in the embedded systems industry, supports Object Oriented Programming (OOP) for the most commonly used microcontrollers.

The compiler benefits from the advantages of the OOP and modernises existing tools for standard 64K architectures and the new generation of devices up to 16 MB such as: the 8051 with or without bank switching; 16 bit Philips XA; Philips MX; Dallas Semiconductors DS80C390; Intel/Atmel 251; and others.

According to Ceibo the C/EC++ compiler and libraries have advanced optimisations that reduce code size and speed up execution time. Also, the compiler uses code generation from the proven Keil C Compiler, thus providing 'bug-free' code.

Ceibo C/EC++ compiler integrates a C/Embedded C++ Compiler, assembler, linker, librarian, debugger, and simulator. The generated code is compatible with all in-circuit emulators as well as Keil µVision2 and Raisonance RIDE environments.

This compiler can be purchased as a new package or as an upgrade to Keil, PantaSoft and other compilers.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

140 W USB-C PD reference design
Altron Arrow Electronics Technology
The design has a wide input range of 90 to 264 V AC, 50-60 Hz, and supports an output voltage range of 5 to 28 V (USB-PD 3.1 specification).

Read more...
Popular aluminium enclosure series expanded
Sivan Electronic Supplies Enclosures, Racks, Cabinets & Panel Products
Gainta has expanded its popular G1xx series of sealed aluminium enclosures which have an IP65 rating to provide protection against dust and moisture.

Read more...
Nanometre-precision piezo actuators
RS South Africa Electronics Technology
TDK Corporation has announced two new piezo actuators that are characterised by a wide dynamic range, a high force-to-volume ratio, but with precision in the nanometre range.

Read more...
Dual compartment enclosures
Sivan Electronic Supplies Enclosures, Racks, Cabinets & Panel Products
The Gainta range of dual-compartment enclosures combine two compartments: an area that is sealed, and an area with a hinged clear lid.

Read more...
Webinar: The evolving electrification of the power distribution system
Infineon Technologies Electronics Technology
New connected car functionality, along with the necessity to reduce the cost, weight and complexity associated with wire harnesses, has led to the transformation of the power distribution system in automotive engineering.

Read more...
Improved MnZn material for power conversion industry
Sivan Electronic Supplies Electronics Technology
Cosmo Ferrites Ltd, a leading manufacturer of soft ferrites, has launched an improved version of CF295 for the power conversion industry.

Read more...
Common mode filter for automotive Ethernet
Avnet Abacus Electronics Technology
TDK Corporation has announced the introduction of its new ACT1210E Series common mode filter for automotive Ethernet 10BASE-T1S.

Read more...
Energising the industrial edge
Electronics Technology
As if the drive to decarbonise energy as part of sustainability and climate change efforts was not enough, the recent rise in energy prices has brought into sharp contrast the need to re-examine how we generate, distribute, and consume electricity.

Read more...
E cores for electric vehicles
Sivan Electronic Supplies Passive Components
Soft ferrites are polycrystalline oxides manufactured by ceramic technology and belong to a class of materials that exhibit the property of ferromagnetism. The right core choice plays a huge part in manufacturing a successful electric vehicle.

Read more...
Samsung begins chip production using 3 nm process technology
EBV Electrolink Electronics Technology
The optimised 3 nm process with GAA architecture achieves 45% lower power usage, 23% improved performance and 16% smaller surface area compared to 5 nm process.

Read more...