BAW-based chips for comms infrastructure

30 April 2019 Analogue, Mixed Signal, LSI

Texas Instruments débuted new bulk acoustic wave (BAW)-based embedded processing and analog chips for the next generation of connectivity and communications infrastructure.

Communications and industrial automation systems with discrete clocking and quartz-crystal devices can be costly, time-consuming and complicated to develop and are often susceptible to environmental stress. The first two devices developed with TI BAW technology – the SimpleLink CC2652RB wireless microcontroller (MCU) and the LMK05318 network synchroniser clock – integrate reference clocking resonators to provide the highest frequency in a small form factor.

This higher level of integration improves performance and increases resistance to mechanical stresses, such as vibration and shock. As a result of stable data transmission enabled by this BAW technology, data synchronisation of wired and wireless signals is more precise and allows for continuous transmission, which means data can be processed more efficiently.

The CC2652RB integrates a BAW resonator within the quad flat no-lead (QFN) package, eliminating the need for an external high-speed 48 MHz crystal. It supports Zigbee, Thread, Bluetooth low energy and proprietary 2,4 GHz connectivity solutions on a single chip, and works across the full -40°C to 85°C temperature range.

The LMK05318 single-channel network synchroniser clock for 400 Gbps links helps systems transmit more data faster while also providing higher margin for system jitter budgets. By delivering very low bit errors for 56 Gbps and emerging 112 Gbps pulse-amplitude modulation-4 links, it enables overall better network performance.

For more information contact Shane Padayachee, Avnet South Africa, +27 11 319 8600, [email protected], www.avnet.co.za

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