DSP, Micros & Memory


PICmicros in small-scale packages

13 March 2002 DSP, Micros & Memory

Microchip Technology's popular PICmicro OTP and Flash microcontrollers are now available in space-saving MicroLeadframe (MLF) packages that are 50% smaller than traditional SSOP alternatives. The elimination of conventional side leads and a near-chip-scale package improves board space efficiency. MLF also incorporates ExposedPad technology, exposing the die paddle that can be soldered directly to the PCB. The first devices available are 28-lead 6x6 mm packages with a common pitch size of 0,65 mm and competitively priced with SOIC devices. These include four OTP devices (PIC16C62B/63B/72A/73B) and two Flash devices (PIC16F73/76).

Avnet Kopp, 011 444 2333

Azona, 012 665 2880

Memec SA, 021 674 4103

Tempe Technology, 011 452 0530



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