Telecoms, Datacoms, Wireless, IoT


Industrial-grade embedded SIM

14 November 2018 Telecoms, Datacoms, Wireless, IoT

Machine-to-machine communication in the Internet of Things (IoT) requires reliable data collection and uninterrupted data transmission. For taking full advantage of the ubiquitous mobile networks, Infineon Technologies is providing the world’s first industrial-grade embedded SIM (eSIM) in a miniature wafer-level chip-scale package (WLCSP).

Deploying eSIM brings a number of advantages for smooth adoption of cellular connectivity into industrial environments. Device manufacturers can increase their design flexibility due to the eSIM’s small footprint, and simplify manufacturing processes as well as global distribution thanks to a single stock-keeping unit. Customers also have the possibility to change their mobile service provider at any time, for example if the quality of the network deteriorates or in the event of a better contract from the mobile operator.

Infineon’s SLM 97 security controller measures only 2,5 x 2,7 mm in size, and supports an extended temperature range of -40°C to 105°C. It provides a high-end feature set fully compliant with the latest GSMA specifications for eSIM.

For more information contact Dirk Venter, Altron Arrow, +27 11 923 9600, [email protected], www.arrow.altech.co.za



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