Microchip has introduced a number of the company's popular PICmicro OTP and Flash microcontrollers in a new competitively-priced, space-saving MicroLeadframe (MLF) package. This eliminates the conventional side leads to improve board space efficiency. The reduction in mounted package height and mass makes the devices 50% smaller than typical SSOP packages, thereby providing entry into applications where space is vital says the manufacturer. The package also incorporates ExposedPad technology, whereby the die paddle is exposed and can be soldered directly to the PCB. All this improves overall manufacturability and reduces thermal limitations.
The first devices will be available in 28-lead 6 x 6 mm packages with a common pitch size of 0,65 mm and competitively priced with typical SOIC devices. The initial product offering will include four OTP devices (PIC16C62B, PIC16C63A, PIC16C72A and PIC16C73B) and two Flash devices (PIC16F73 and PIC16F76). Additional devices ranging from 8-lead to 40-lead packages are also planned for 2002.
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