19 July 2017Manufacturing / Production Technology, Hardware & Services
Viscom recently débuted the X7056-II, its newest system for automatic 3D X-ray inspection. Very short handling times in combination with outstanding image quality and expanded inspection depth make this system ideal for use in high-end electronics production.
Based on FastFlow, the fast handling option for Viscom AOI systems, the system is ideally suited for use in production lines that require high throughput despite extensive inspection of hidden solder joints. Through use of xFastFlow, the time needed for component infeed and outfeed is cut by more than half, and up to three boards can be in the system simultaneously. Due to the time saved, 3D inspections which used to be done selectively can be expanded to cover far more than just individual components.
By taking advantage of the third dimension, users have the benefit of an unshadowed view of components and hidden solder joints. The X7056-II, with the help of the planar CT, can automatically resolve any covered areas on double-sided printed circuit boards to clearly reveal important defect features and allow exact evaluations. During periods of high packaging and placement densities, this results in fewer false calls and so more efficient production. This also makes program generation simpler.
A powerful flat panel detector, movable on an xy-table, provides an advantage over rigid detector solutions by virtue of the ability to employ 2D and 3D inspections on a component, both selectively and combined. In particular, the optimised image acquisition positioning results in a further increase in speed or – optionally – an even better image quality. The system, like its predecessors, can be expanded to an AOI/AXI combination system.
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