Computer/Embedded Technology


HMI development modules

31 January 2017 Computer/Embedded Technology

Bridgetek has introduced a series of development modules to assist engineering professionals as they strive to implement more sophisticated and functionality-rich human machine interfaces (HMIs) and ensure market differentiation.

Based on the second generation of the multi-award winning Embedded Video Engine (EVE) devices, the modules provide engineers with a foundation on which to rapidly prototype, or even directly construct HMIs. They each have a 5,0” format 800 x 480 pixel TFT display capable of supporting both portrait and landscape orientations. A built-in audio amplifier is also included on these units so that an external 1 W speaker can be attached to them.

There are a total of 4 products in this new series. The ME812AU-WH50R and ME813AU-WH50C respectively utilise FT812 and FT813 EVE advanced graphics controller ICs, and correspondingly support resistive and capacitive touch screens. Each of these modules behaves as a USB device, with an FT4222H USB-to-SPI bridge incorporated so that they can be accessed from a PC or any other form of USB host.

In contrast, the ME812A-WH50R and ME813A-WH50C modules (with resistive and capacitive touch screens respectively) behave as SPI slaves. Consequently they require use of an SPI master in order to take care of microcontroller interfacing and system integration. Both of the capacitive touch screen based modules offer multi-touch operation (with provision for up to five simultaneous touch points). In the case of the resistive touch screen modules, they allow touch operation through gloved hands (something of great value in industrial applications).

EVE graphics controller ICs combine display, touch and audio functionality within a single chip and take an innovative object-oriented approach to HMI implementation that is proving highly effective. The second generation EVE devices at the heart of each of these new development modules have greater pixel resolution than the previous EVE ICs, resulting in sharper image rendering and greater colour depth. They also have accelerated data transfer and image/video loading capabilities, enhanced video playback, plus expanded memory resources. All of the modules are supplied with a bezel that has four mounting holes to facilitate system assembly.

For more information contact Fernando Da Silva, Electrocomp, +27 (0)11 458 9000, [email protected], www.electrocomp.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Generate waveforms at 10 GS/s
Vepac Electronics Computer/Embedded Technology
New flagship arbitrary waveform generator cards from Spectrum Instrumentation generate waveforms with 2,5 GHz bandwidth and 16-bit vertical resolution.

Read more...
Quad-port 10GBASE-T controller
Rugged Interconnect Technologies Computer/Embedded Technology
he SN4-DJEMBE, available from Rugged Interconnect, is a networking adaptor card for CompactPCI Serial systems, equipped with four individual controllers for 10GBASE-T.

Read more...
HPE policy management platform
Computer/Embedded Technology
Duxbury Networking has announced the availability of the HPE Aruba ClearPass policy management platform, that enables business and personal devices to connect to an organisational level, in compliance with corporate security policies.

Read more...
IoT gateways
Brandwagon Distribution Computer/Embedded Technology
IoT Gateways are hardware and software devices that are responsible for collecting data from connected devices, managing communication between devices and the cloud, and processing and analysing the data before sending it to the cloud for further analysis.

Read more...
1.6T Ethernet IP solution to drive AI and hyperscale data centre chips
Computer/Embedded Technology
As artificial intelligence (AI) workloads continue to grow exponentially, and hyperscale data centres become the backbone of our digital infrastructure, the need for faster and more efficient communication technologies becomes imperative. 1.6T Ethernet will rapidly be replacing 400G and 800G Ethernet as the backbone of hyperscale data centres.

Read more...
Keeping it cool within the edge data centre
Computer/Embedded Technology
The creation of more data brings with it the corresponding need for more compute power and more data centres, which, in turn, can create unique challenges with regards to securing the environment and cooling the IT loads.

Read more...
NEX XON becomes Fortinet partner
NEC XON Computer/Embedded Technology
This designation demonstrates NEC XON’s ability to expertly deploy, operate, and maintain its own end-to-end security solutions, helping organisations to achieve digital acceleration.

Read more...
Online tool for data centre planning and design
Computer/Embedded Technology
Vertiv has unveiled a new tool, Vertiv Modular Designer Lite, designed to transform and simplify the configuration of prefabricated modular (PFM) data centres.

Read more...
SMD choke for currents up to 48 A
Electrocomp Passive Components
Designed for rated currents from 36 to 48 A, these surface-mountable components from TDK cover a range of inductance values from 2,3 to 8,5 µH.

Read more...
Advanced electrolytic hybrid capacitor
Electrocomp Passive Components
Online Teaser: The capacitor series from Panasonic achieves a maximum ripple current of 3,3 to 4,6 A, which is approximately 50% higher than comparable case sizes.

Read more...