Infineon Technologies extended its product portfolio of thyristor/diode modules in solder bond technology with a 50 mm module.
These bipolar modules address the growing market for cost-effective solutions even in demanding applications. Solder bond modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must. Typical applications for the new 50 mm modules are drives, power supplies and welding.
The 50 mm variant covers current ratings from 280 A to 330 A, while existing 20 mm and 34 mm models have been in production for more than two years and already proven their reliability in the field. All modules have been developed as cost- and performance-optimised alternative to pressure contact technology. They are packaged in industrial standard housings with an electrically insulated base plate.
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