Isolated TO-220 style plastic package increases power density

Electronics Technology

21 November 2001 Electronics Technology

IXYS introduced a new plastic encapsulated package in the 'hole-less' TO-220 outline with an electrically isolated mounting tab. Existing packages with internal isolation involve bonding an insulator between the silicon chip and copper tab and have proved to be quite expensive. In this new package, called ISOPLUS220, the standard copper lead frame has been replaced by direct-copper-bonded alumina to which any discrete semiconductor, from diodes to thyristors to IGBTs to MOSFETs, can be soldered. The elimination of the screw hole makes room for larger power semiconductor dice, which can control higher currents than previously possible using the TO-220 package.

The package simplifies power semiconductor device assembly and may be mounted directly onto a heatsink with no isolation interface material because the isolation voltage rating of mounting tab to the chip and its leads is 2500 V(rms). Also,the use of a DCB substrate in place of a copper lead frame has the advantage of low isolated thermal resistance junction-to-heatsink because power dissipated flows to the heatsink through only one nonsoldered interface.

Avnet Kopp

(011) 444 2333

[email protected]

www.avnet.co.za

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Isolated TO-220 style plastic package increases power density

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