13 July 2016Manufacturing / Production Technology, Hardware & Services
Henkel Adhesive Technologies’ award-winning Technomelt® materials have long been recognised as the industry standard for high-performance low pressure molding applications.
Extending the effectiveness of the Technomelt portfolio outside of proven encapsulation processes, Henkel Adhesive Technologies has developed a newly formulated material providing a streamlined and economical alternative to conventional masking techniques for various coating requirements.
Technomelt AS 8998 is designed to provide simple and fast dispensability to mask ‘keep out zones’ for printed circuit assemblies that will undergo subsequent coating or chemical deposition processes. Unlike traditional manual taping methods, the slump-resistant material offers a fast, highly precise, automated, easy-to-remove approach to mask specific components or designated PCB areas that must remain free of any applied protective coatings.
Technomelt AS 8998 is compatible with common automated dispensing systems to allow for quick, precise deposition in very small areas, ensuring accurate coverage only where needed, with no material migration. It peels off cleanly, delivering an advantage over UV or liquid masking products.
This silicone-free, halogen-free, RoHS-compliant material has excellent green strength immediately after dispensing and solidifies upon cooling with no induced (thermal or UV) curing required. Compatible with numerous substrate surfaces, the hot melt material provides good adhesion during various coating processes, following which it peels off quickly and cleanly, leaving defined edges and zero residue.
Technomelt AS 8998 is compatible with thermal processes up to 100°C, which aligns with most coating applications. Subsequent formulations with higher temperature resistance are in development.
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