23 March 2016Manufacturing / Production Technology, Hardware & Services
Kyzen has conducted an extensive study, via controlled laboratory tests, in the interest of improving stencil printing reliability. The company will announce its comprehensive findings at the 2016 IPC APEX Expo, but has previewed the presentation by revealing that its research indicates consistently lower production yields are delivered when some of the industry’s most common cleaning agents are utilised in under-stencil wipe applications. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts.
The evidence from this lengthy and objective study includes process videos and strongly supports the need for a wet wipe with an engineered solvent that matches to the flux composition. It concludes that reliable and acceptable assemblies start with a clean print. In addition, clean prints are more achievable on a reliable basis with engineered solutions, such as Kyzen’s CYBERSOLV C8882, than they are with standard IPA.
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