4 November 2015Manufacturing / Production Technology, Hardware & Services
The X7058 was specially developed for ultra-fast, in-line-capable automatic 3D X-ray inspection of electronic assemblies. With this system from Viscom, the entire electronic assembly is 100% 3D-inspected – of particular interest for EMS companies which need to produce and inspect complex, high-value electronic assemblies at the highest quality, efficiently and at low cost.
The specially developed 3D X-ray sensor technology of the new AXI system provides optimum contrasts and a superb image quality. During the 100% top and bottom side 3D inspection, each detail of the entire electronic assembly is scanned several times by high-power line scanning cameras.
The heart of the X-ray technology is the high-performance sealed microfocus X-ray tube with up to 130 kV/390 μA. The 3D reconstruction is performed on the basis of planar computed tomography. Even larger electronic assemblies, up to a printed circuit board size of 560 x 508 mm (optionally 762 mm length), are reliably inspected.
The particular advantage for efficiency is the fast, reliable multi-level inspection in just one inspection process. The system features an automatic separation of top and bottom sides through the software (Placement Level Separation). Without this feature, during X-ray penetration the components on the top and bottom sides would cover each other to make reliable defect detection impossible. Thus, multilayer electronic assemblies assembled on both sides can be inspected for all typical SMD defects reliably, in a way that is very convenient for the operating personnel.
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