4 November 2015Manufacturing / Production Technology, Hardware & Services
The sensor system 3D·EyeZ by Goepel Electronics, through its shadow-free measurement, offers a variety of uses in electronics manufacturing. In addition to quality assurance for solder joints and components, 3D circumference inspection for connector insertion on printed circuit boards (PCB) is possible. In addition to sensing deflection in the x and y axes, the 3D·EyeZ module can measure the height of a pin.
Despite increasing miniaturisation and increasing density on PCBs, connectors are still a common part among the assembled components. In addition to solder joints and polarity, the mechanical position of the individual pins is crucial for quality evaluation.
To assure the proper seating of the connector into the respective counterpart in final assembly, testing of the pin tips is not only performed for the x and y axes, but also for the z axis. This involves not only the measurement of the positions with respect to themselves but also in relation to other objects, such as package parts or holes in PCBs. In this case a combination of several measurement methods is required: 3D methods for height positions and co-planarity measurement as well as orthogonal and inclined 2D image recordings for the x/y positioning in a plane.
By linking each resulting measurement and the pre-set tolerance values for every position, an extremely flexible way to include 3D measurement of the relevant criteria is possible. 3D·EyeZ is available in combination with the orthogonal camera and the rotatable angled-view module Chameleon for Goepel’s AOI (automatic optical inspection) systems, both for inline integration as well as for standalone.
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