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New ProFlow family members to debut at Productronica

24 October 2001 News

The latest additions to DEK's ProFlow product family will break cover at Productronica this November, reports the company.

First is a new dual chamber transfer head aimed at processes requiring high paste or adhesive deposition volume. It is joined by extensive wiper options and an enhanced 'paste low' sensor for greater paste utilisation. The dual chamber transfer head optimises the movement and conditioning of a large volume of paste or adhesive. Conditioning the material inside the head prior to deposition is critical to process control, and the dual chamber head now makes processes such as pin in paste, PumpPrinting and step-repeat patterns easier and more repeatable at line speed.

DEK said it will continue to offer the original single chamber head as the standard ProFlow configuration.

The broad selection of precision wipers, including stepped or flat titanium for use with metal stencils, or mylar for delicate surfaces such as emulsion screens and PumpPrint stencils, allows users to access the benefits of ProFlow DirEKt Imaging in many electronic applications.

The new ProFlow 'paste low' sensor reduces paste wastage and allows precise user control via a micrometer scale calibrated in 0,5 mm steps. Data from field trials has shown paste wastage can now be reliably maintained within 4% to 8% of the total cassette volume, claims DEK.



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