Magnetics now offers its XFLUX distributed air gap cores in 50 x 30 mm (00X5030Bxxx), 60 x 30 mm (00X6030Bxxx), 70 x 30 mm (00X7030Bxxx) and 80 x 30 mm (00X8030Bxxx) versions, with permeabilities of 26, 40 and 60.
These cores offer an economical, high saturation (1,6 T) solution for use in low-and medium-frequency inductors and chokes. The high saturation is advantageous in applications where inductance under load is critical, such as inverters for renewable energy and uninterruptible power supplies.
XFLUX cores are made from 6,5% silicon iron powder – a high-temperature material that exhibits no thermal ageing. Their material properties and the flexibility of their geometries make them ideal for custom assembly. Discrete air gaps between XFLUX blocks are not generally needed because the air gap is inherent in the material. At the same time, extremely smooth mating surfaces (such as are employed with ferrites) are not required because the small incidental gap between blocks does not add appreciable extra gap and does not reduce inductance significantly.
The adhesives used for assembling XFLUX blocks generally need to be thicker than those commonly used for ferrite assemblies, since their surface is rougher and more porous. Cores may require a double application of adhesive to allow for the porosity in the surface of the blocks.
3,75 GHz RF inductor RF Design
Passive Components
The ceramic chip wire wound inductor from Coilcraft features a DC resistance of 1 O, a DC current of 175 mA, and a self-resonant frequency of 3,75 GHz.
Read more...Upgraded power inductor series iCorp Technologies
Passive Components
Sunlord’s multiphase co-fired power inductor HTF-MP series has upgraded the single-phase HTF-H products in terms of integrated applications.
Read more...Advanced high-voltage capacitors RS South Africa
Passive Components
These new capacitor families from Panasonic are designed for surface-mount and radial lead applications, offering remarkable performance improvements that meet the evolving needs of industrial applications.
Read more...Moulded inductors Future Electronics
Passive Components
Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.
Read more...New components from KEMET available from TME
Passive Components
Available from KEMET, one of the largest suppliers of passive components, these new components consist of toroidal inductors (ferrites) and capacitors which boast high current performance.
Read more...Miniature reed relay with 80 W rating
Passive Components
Pickering Electronics has introduced its latest high-power reed relay, Series 44, featuring an 80 W power rating, while stacking on a compact 0,25-inch pitch.
Read more...The future of on-board charging Future Electronics
Passive Components
Engineered to elevate charging performance, the selection of Vishay capacitors, resistors, and other passives redefine reliability and efficiency in on-board charging technology.
Read more...Cooling on a chip
Passive Components
This all-silicon, solid-state active cooling chip by xMEMS is designed for thermal management applications for ultra-mobile devices and next-gen AI solutions.
Read more...First 100 µF MLCC in 0603 packaging RS South Africa
Passive Components
Murata is expanding its range of multilayer ceramic capacitors (MLCC) with the groundbreaking new GRM188C80E107M and GRM188R60E107M.