MultiDimension Technology has announced the MIS63xx sensors for magnetic image scanning at high resolutions. They are designed for financial anti-counterfeit appliances in banknote sorters, ATM and vending machines, and are suited for non-destructive testing (NDT) applications.
The devices are designed with an array of TMR sensors with a spatial resolution of 50 dpi, along with high sensitivity and excellent noise immunity for retrieving the embedded magnetic image on banknotes.
In conjunction with this announcement, the company released the TMR6201, TMR6206 and TMR6218 as enhanced versions of its current offering of 1/6/18-channel banknote reader sensors, with higher sensitivity, improved noise immunity and competitive pricing. In addition, the TMR6201D and TMR6218D are new banknote reader sensors with digital outputs.
LTE Cat 1 bis communication iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The EG810M series is a series of LTE Cat 1 bis wireless communication modules specially designed by Quectel for M2M and IoT applications.
Read more...A new era in modular I/O solutions Rugged Interconnect Technologies
Analogue, Mixed Signal, LSI
Aerospace and defence system designers are demanding scalable and high-performance I/O solutions and while traditional mezzanine standards have proven reliable, they often fall short of meeting modern bandwidth, size, and flexibility requirements.
Read more...Smart module for multi-media devices iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Powered by a Qualcomm processor, Quectel’s new SC200V is designed to deliver exceptional performance across system capabilities, multimedia functions, and network connectivity.
Read more...High voltage instrument op-amp iCorp Technologies
Analogue, Mixed Signal, LSI
The SGM621B is a high accuracy, high voltage instrumentation amplifier, which is designed to set any gain from 1 to 10 000 with one external resistor.
Read more...IoT/M2M-optimised LTE module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The EG810M series is a series of LTE Cat 1 bis wireless communication modules specially designed by Quectel for M2M and IoT applications.
Read more...High-speed SAR ADC simplifies design Altron Arrow
Analogue, Mixed Signal, LSI
The ADI AD4080 simplifies data converter integration by integrating a low drift reference buffer, low dropout regulators and a 16K result data FIFO buffer.
Read more...Tiny power inductor for low noise applications iCorp Technologies
Passive Components
With the evolution of Bluetooth, chips, sensors and other technologies, the design of TWS earphones is becoming smaller and thinner, and the performance and size requirements of integrated inductors need to follow suit.
Read more...Upgraded multiphase power inductor iCorp Technologies
Power Electronics / Power Management
The increased demand for computing power in data centres has resulted in the development of multi-phase ultra-low profile, ultra-high current copper magnetic co-fired power inductors.
Read more...Wi-Fi 4 and Bluetooth LE 5.0 module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The FGM840R has a built-in Cortex M33 and M23 dual-core processor and supports IEEE 802.11a/b/g/n protocol and BLE 5.0.
Read more...ESP32-C6 achieves Thread 1.4 certification iCorp Technologies
DSP, Micros & Memory
The ESP32-C6 has achieved Thread 1.4 Interoperability Certification, offering secure commissioning, advanced diagnostics, enhanced internet connectivity with Thread over Infrastructure, and optimised energy-efficient device roles.