Lattice Semiconductor announced volume production of its MachXO3L FPGA family in four tiny packages as small as 2,5 x 2,5 mm. Also launched were two new low-cost breakout boards that enable designers to evaluate the devices’ hard IP, versatile I/O and other capabilities.
The product family boasts low cost per I/O enabled by wafer-level chip-scale (WLCSP) and advanced chip-array BGA (caBGA) technology with package sizes as small as 2,5 x 2,5 mm and having up to 335 I/O in a 17 x 17 mm package. These enable engineers to fit big functionality in tiny spaces while maintaining cost competitiveness in applications as diverse as industrial infrastructure and smart connected devices.
MachXO3L devices integrate an onboard regulator to simplify system design, eliminate thermal constraints and help engineers realise power efficient, always-on devices. Instant-on capability with boot-up time of less than 1 ms, coupled with background system upgrade capability, dual boot and a single supply, makes them ideal for controlling bring-up and system initialisation.
The chips provide hardened IP blocks including I²C, SPI, embedded memory and an oscillator, all in an instant-on programmable fabric. They also support MIPI D-Phy based DSI and CSI2 I/O.
ST’s biosensing tech enables next-gen wearables Future Electronics
DSP, Micros & Memory
The highly integrated biosensor device combines an input channel for cardio and neurological sensing, with motion tracking and embedded AI core, for healthcare and fitness applications.
Read more...1700 V GaN Switcher IC Future Electronics
Power Electronics / Power Management
Power Integrations has introduced a new member of its InnoMux-2 family of single-stage regulated multi-output offline power supply ICs, the industry’s first 1700 V gallium nitride switch.
Read more...32-bit range of MCUs Future Electronics
DSP, Micros & Memory
If your design has outgrown the capabilities of 8- or 16-bit MCUs, the PIC32 family delivers easy scalability, enhanced performance, and larger memory options.
Read more...Moulded inductors Future Electronics
Passive Components
Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.
Read more...i.MX RT700 for the AI-enabled edge Future Electronics
DSP, Micros & Memory
Designed to enable significant power savings, the highly integrated i.MX RT700 crossover MCU features NXP’s eIQ Neutron Neural Processing Unit, delivering up to 172x AI acceleration at the edge.
Read more...The future of on-board charging Future Electronics
Passive Components
Engineered to elevate charging performance, the selection of Vishay capacitors, resistors, and other passives redefine reliability and efficiency in on-board charging technology.
Read more...Acceleration sensors for wearables Future Electronics
Test & Measurement
Bosch Sensortec has introduced two new acceleration sensors, the BMA530 and BMA580, both offered in a compact size of only 1,2 x 0,8 x 0,55 mm.
Read more...Compact MCU with advanced customisation Future Electronics
Telecoms, Datacoms, Wireless, IoT
The Microchip PIC16F13145 is the ideal solution for designs with minimal logic and configurable analogue I/O, featuring rapid comparators for improved data acquisition.
Read more...Intelligent power delivery Future Electronics
Power Electronics / Power Management
The MEAN WELL DRS-240 and DRS-480 DIN rail power supplies present an all-in-one solution for intelligent power delivery in systems that require the highest reliability and safe operation.
Read more...Advanced tech for next-gen cockpit system design Future Electronics
DSP, Micros & Memory
Infineon delivers high-performance microcontrollers, memories, human-machine interface controllers, and automotive-grade security solutions tailored for automotive infotainment systems.
printer friendly version