TDK has expanded its MLP series of multilayer power inductors with the new MLP1005M1R0D in case size IEC 1005. The new component measures just 1,0 x 0,5 x 0,7 mm and offers a rated inductance of 1,0 µH and a rated current of 500 mA.
The component employs a particularly low-loss ferrite material, giving it electrical characteristics that allow its application in power supply circuits rated for up to 500 mA.
With the addition of the new type, TDK’s broad lineup of multilayer power inductors now covers case sizes from 2520 (2,5 x 2,0 mm) to 1005, including 2016 ( 2,0 x 1,6 mm), 2012 ( 2,0 x 1,2 mm) and 1608 (1,6 x 0,8 mm) with rated currents up to 2300 mA and rated inductances up to 10 µH.
The role of passives in emerging applications
Passive Components
Mouser Electronics has released a new eBook in collaboration with Bourns, exploring the role of passives in emerging electronics applications, including renewables, hybrids, and electric vehicles.
Read more...Updated curve fit equation tool
Passive Components
A new version of Magnetics’ Curve Fit Equation tool, which is an Excel file for design engineers, is now available.
Read more...Updated curve fit equation tool Tamashi Technology Investments
Passive Components
A new version of Magnetics’ Curve Fit Equation tool, which is an Excel file for design engineers, is now available.
Read more...PCB connectors for power systems Phoenix Contact
Passive Components
With the new PC 6 PCB connectors with screw connection, Phoenix Contact’s classic connection technology is available with enhanced touch protection for the new pin connector pattern.
Read more...SPE connector range Phoenix Contact
Passive Components
Single Pair Ethernet (SPE) is a communication technology that realises Industry 4.0 and IIoT applications, and Phoenix Contact’s Combicon range are ideal for SPE connections.
Read more...TDK expands MLCC series RS South Africa
Passive Components
TDK Corporation has expanded its CGA series of multilayer ceramic capacitors, currently being the highest capacitance in 100 V products for automotive applications.
Read more...Antennas to meet all connectivity requirements Electrocomp
Telecoms, Datacoms, Wireless, IoT
Kyocera AVX RF antennas meet today’s connectivity demands in the LTE, Wi-Fi, Bluetooth, GNSS, and ISM wireless bands, available in surface mount, patch or external configurations.
Read more...Stainless steel pushbutton enclosures Electrocomp
Enclosures, Racks, Cabinets & Panel Products
he HYPB series from Hammond is a hygienic type 4X stainless steel pushbutton enclosure designed for use in environments where regular high temperature, high-pressure washdowns are required.
Read more...SMD varistors with huge surge current capability Electrocomp
Power Electronics / Power Management
TDK Corporation has introduced two new varistor series in SMD design, the larger of the two capable of handling a surge current of 10 000 A.