Freescale Semiconductor has introduced a new enhancement-mode pHEMT low noise amplifier (LNA) based on GaAs process technology and designed to optimise receiver performance for a broad array of wireless systems operating between 700 and 1400 MHz.
Typical applications include small cell and macrocell transceivers, as well as a range of applications requiring extremely low noise figures, high linearity, and high RF output power.
The noise figure of the new MML09231H is 0,36 dB at 900 MHz, making it ideal for receiver designers as it can boost product sensitivity to very low-level signals. In addition, it has an output third order intercept point (OIP3) of 37,4 dBm at 900 MHz for the high linearity required by today’s wireless systems.
The chip can tolerate a maximum input signal of +20 dBm, has an RF output peak power of +24,5 dBm (280 mW), high reverse isolation of -21 dB, small-signal gain of 17,2 dB (externally adjustable) and current consumption of only 55 mA from a single 5 V d.c. supply.
Other features include an integrated power-down pin, active bias control for maintaining constant current, unconditional stability over temperature, and low external component count.
E-mobility innovation: balancing power, sensors, and connectivity Future Electronics
Manufacturing / Production Technology, Hardware & Services
The future of e-mobility is being shaped by innovations in power systems, connectivity, and sustainable design, and this article explores key technologies driving the industry forward.
Read more...ST’s biosensing tech enables next-gen wearables Future Electronics
DSP, Micros & Memory
The highly integrated biosensor device combines an input channel for cardio and neurological sensing, with motion tracking and embedded AI core, for healthcare and fitness applications.
Read more...Infineon launches Edge Ai software solution Altron Arrow
Analogue, Mixed Signal, LSI
Infineon has introduced DEEPCRAFT, a new software solution category brand for Edge AI and machine learning, after the company recognised the huge potential of Edge AI for the market.
Read more...1700 V GaN Switcher IC Future Electronics
Power Electronics / Power Management
Power Integrations has introduced a new member of its InnoMux-2 family of single-stage regulated multi-output offline power supply ICs, the industry’s first 1700 V gallium nitride switch.
Read more...32-bit range of MCUs Future Electronics
DSP, Micros & Memory
If your design has outgrown the capabilities of 8- or 16-bit MCUs, the PIC32 family delivers easy scalability, enhanced performance, and larger memory options.
Read more...Moulded inductors Future Electronics
Passive Components
Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.
Read more...i.MX RT700 for the AI-enabled edge Future Electronics
DSP, Micros & Memory
Designed to enable significant power savings, the highly integrated i.MX RT700 crossover MCU features NXP’s eIQ Neutron Neural Processing Unit, delivering up to 172x AI acceleration at the edge.
Read more...16-bit voltage output denseDAC Altron Arrow
Analogue, Mixed Signal, LSI
The AD5766 uses a versatile four-wire serial interface that operates at clock rates of up to 50 MHz for write mode, and is compatible with SPI, QSPI, MICROWIRE, and DSP interface standards.
Read more...The future of on-board charging Future Electronics
Passive Components
Engineered to elevate charging performance, the selection of Vishay capacitors, resistors, and other passives redefine reliability and efficiency in on-board charging technology.
Read more...Acceleration sensors for wearables Future Electronics
Test & Measurement
Bosch Sensortec has introduced two new acceleration sensors, the BMA530 and BMA580, both offered in a compact size of only 1,2 x 0,8 x 0,55 mm.
printer friendly version